Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, Kazuhiro Nogita

Research output: Contribution to journalArticle

15 Citations (Scopus)

Abstract

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu BGA solder joints was investigated by using synchrotron micro X-ray fluorescence (XRF) analysis and synchrotron X-ray diffraction (XRD). Compared to Sn-0.7Cu/Cu BGA joints, Ni containing solder show suppressed Cu3Sn growth in both reflow and annealed conditions. In as-reflowed Sn-0.7Cu-0.05Ni/Cu BGA joints, Ni was relatively homogenously distributed within interfacial (Cu,Ni)6Sn5. During subsequent annealing, the diffusion of Ni in Cu6Sn5 was limited and it remained concentrated adjacent the Cu substrate where it contributes to the suppression of Cu3Sn formation at the interface between the Cu substrate and Cu6Sn5 intermetallics.

Original languageEnglish
Pages (from-to)20-27
Number of pages8
JournalIntermetallics
Volume54
DOIs
Publication statusPublished - Nov 2014

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Ball grid arrays
Intermetallics
Synchrotrons
Soldering alloys
Substrates
Fluorescence
Annealing
X ray diffraction
X rays

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Mechanics of Materials
  • Mechanical Engineering
  • Metals and Alloys
  • Materials Chemistry

Cite this

Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. / Zeng, Guang; McDonald, Stuart D.; Mu, Dekui; Terada, Yasuko; Yasuda, Hideyuki; Gu, Qinfen; Nogita, Kazuhiro.

In: Intermetallics, Vol. 54, 11.2014, p. 20-27.

Research output: Contribution to journalArticle

Zeng, Guang ; McDonald, Stuart D. ; Mu, Dekui ; Terada, Yasuko ; Yasuda, Hideyuki ; Gu, Qinfen ; Nogita, Kazuhiro. / Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints. In: Intermetallics. 2014 ; Vol. 54. pp. 20-27.
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AU - Mu, Dekui

AU - Terada, Yasuko

AU - Yasuda, Hideyuki

AU - Gu, Qinfen

AU - Nogita, Kazuhiro

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