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Ni segregation in the interfacial (Cu,Ni)6Sn5 intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints
Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, Kazuhiro Nogita
Research output: Contribution to journal › Article › peer-review
21
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(Scopus)