Ni segregation in the interfacial (Cu,Ni)₆Sn₅ intermetallic layer of Sn-0.7Cu-0.05Ni/Cu ball grid array (BGA) joints

Guang Zeng, Stuart D. McDonald, Dekui Mu, Yasuko Terada, Hideyuki Yasuda, Qinfen Gu, Kazuhiro Nogita

Faculty of Engineering

Research output: Contribution to journal › Article › peer-review

19 Citations (Scopus)

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Chemical Compounds

Engineering & Materials Science