Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: Short review

M. M.A. Mohd Salleh, Stuart Mcdonald, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

25 Citations (Scopus)

Abstract

To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of nonmetal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders.

Original languageEnglish
Title of host publicationInformation Technology for Manufacturing Systems IV
Pages260-266
Number of pages7
DOIs
Publication statusPublished - Oct 29 2013
Event4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013 - Auckland, New Zealand
Duration: Aug 28 2013Aug 29 2013

Publication series

NameApplied Mechanics and Materials
Volume421
ISSN (Print)1660-9336
ISSN (Electronic)1662-7482

Other

Other4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013
CountryNew Zealand
CityAuckland
Period8/28/138/29/13

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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    Mohd Salleh, M. M. A., Mcdonald, S., & Nogita, K. (2013). Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: Short review. In Information Technology for Manufacturing Systems IV (pp. 260-266). (Applied Mechanics and Materials; Vol. 421). https://doi.org/10.4028/www.scientific.net/AMM.421.260