TY - GEN
T1 - Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation
T2 - 4th International Conference on Information Technology for Manufacturing Systems, ITMS 2013
AU - Mohd Salleh, M. M.A.
AU - Mcdonald, Stuart
AU - Nogita, Kazuhiro
N1 - Copyright:
Copyright 2013 Elsevier B.V., All rights reserved.
PY - 2013
Y1 - 2013
N2 - To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of nonmetal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders.
AB - To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead-free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of nonmetal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders.
UR - http://www.scopus.com/inward/record.url?scp=84886258339&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84886258339&partnerID=8YFLogxK
U2 - 10.4028/www.scientific.net/AMM.421.260
DO - 10.4028/www.scientific.net/AMM.421.260
M3 - Conference contribution
AN - SCOPUS:84886258339
SN - 9783037858783
T3 - Applied Mechanics and Materials
SP - 260
EP - 266
BT - Information Technology for Manufacturing Systems IV
Y2 - 28 August 2013 through 29 August 2013
ER -