Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling

Lijun Liu, Satoshi Nakano, Koichi Kakimoto

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Three-dimensional (3D) thermal flow of silicon melt in an electromagnetic Czochralski (CZ) system was numerically investigated with a recently developed 3D global model. The electromagnetic CZ system was established with a transverse magnetic field and an injected electric current applied on the melt surface. Different azimuthal and radial positions of the electrode on the melt surface were taken into account to investigate their influences on the heat and mass transfer in the melt, as well as on the melt-crystal interface. The influence of the electric current direction on the melt flow pattern and temperature distribution was also demonstrated. The results showed that the position of the electrode on the melt surface and the direction of the applied electric current play an important role in controlling the heat and mass transfer in the silicon melt.

Original languageEnglish
Title of host publicationProceedings of the ASME Summer Heat Transfer Conference, HT 2005
Pages229-235
Number of pages7
Volume3
DOIs
Publication statusPublished - Dec 1 2005
Event2005 ASME Summer Heat Transfer Conference, HT 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Other

Other2005 ASME Summer Heat Transfer Conference, HT 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Fingerprint

Crystal growth from melt
Electric currents
Numerical analysis
Mass transfer
Heat transfer
Silicon
Electrodes
Flow patterns
Temperature distribution
Magnetic fields
Crystals

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Liu, L., Nakano, S., & Kakimoto, K. (2005). Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling. In Proceedings of the ASME Summer Heat Transfer Conference, HT 2005 (Vol. 3, pp. 229-235). [HT2005-72496] https://doi.org/10.1115/HT2005-72496

Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling. / Liu, Lijun; Nakano, Satoshi; Kakimoto, Koichi.

Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 3 2005. p. 229-235 HT2005-72496.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Liu, L, Nakano, S & Kakimoto, K 2005, Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling. in Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. vol. 3, HT2005-72496, pp. 229-235, 2005 ASME Summer Heat Transfer Conference, HT 2005, San Francisco, CA, United States, 7/17/05. https://doi.org/10.1115/HT2005-72496
Liu L, Nakano S, Kakimoto K. Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling. In Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 3. 2005. p. 229-235. HT2005-72496 https://doi.org/10.1115/HT2005-72496
Liu, Lijun ; Nakano, Satoshi ; Kakimoto, Koichi. / Numerical analysis of an electromagnetic CZ-SI growth process by 3D global modeling. Proceedings of the ASME Summer Heat Transfer Conference, HT 2005. Vol. 3 2005. pp. 229-235
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