Numerical analysis of dislocation density and residual stress in a GaN single crystal during the cooling process

S. Nakano, B. Gao, Koichi Kakimoto

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In this study, we investigate the influence of thermal stress on the dislocation density and residual stress in GaN single crystals by numerical analysis. The results show that the dislocation density increases, but the thermal stress does not decrease, and the residual stress increases throughout the cooling process. The reason for this phenomenon is that the dislocation density is higher at the periphery of the crystal and distribution of dislocation density in the crystal is inhomogeneous. Then, the increase of dislocation does not allow the thermal stress on the entire crystal to relax.

Original languageEnglish
Pages (from-to)839-844
Number of pages6
JournalJournal of Crystal Growth
Volume468
DOIs
Publication statusPublished - Jun 15 2017

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Dislocations (crystals)
Thermal stress
residual stress
numerical analysis
Numerical analysis
Residual stresses
Single crystals
Cooling
cooling
thermal stresses
Crystals
single crystals
crystals

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Inorganic Chemistry
  • Materials Chemistry

Cite this

Numerical analysis of dislocation density and residual stress in a GaN single crystal during the cooling process. / Nakano, S.; Gao, B.; Kakimoto, Koichi.

In: Journal of Crystal Growth, Vol. 468, 15.06.2017, p. 839-844.

Research output: Contribution to journalArticle

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