Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron

Kohei Ito, Ryohei Muramoto, Isamu Shiozawa, Yasushi Kakimoto, Takashi Masuoka

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.

Original languageEnglish
Title of host publicationProceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages2099-2103
Number of pages5
VolumePART C
Publication statusPublished - 2006
EventASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States
Duration: Jul 17 2005Jul 22 2005

Other

OtherASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
CountryUnited States
CitySan Francisco, CA
Period7/17/057/22/05

Fingerprint

Numerical analysis
Electrons
Microfabrication
Thermoelectric power
Metals
Heat flux
Thermal conductivity
Semiconductor materials
Computer simulation
Hot Temperature

All Science Journal Classification (ASJC) codes

  • Engineering(all)

Cite this

Ito, K., Muramoto, R., Shiozawa, I., Kakimoto, Y., & Masuoka, T. (2006). Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART C, pp. 2099-2103)

Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. / Ito, Kohei; Muramoto, Ryohei; Shiozawa, Isamu; Kakimoto, Yasushi; Masuoka, Takashi.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 2099-2103.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Ito, K, Muramoto, R, Shiozawa, I, Kakimoto, Y & Masuoka, T 2006, Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART C, pp. 2099-2103, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 7/17/05.
Ito K, Muramoto R, Shiozawa I, Kakimoto Y, Masuoka T. Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. 2006. p. 2099-2103
Ito, Kohei ; Muramoto, Ryohei ; Shiozawa, Isamu ; Kakimoto, Yasushi ; Masuoka, Takashi. / Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. pp. 2099-2103
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