Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron

Kohei Ito; Ryohei Muramoto; Isamu Shiozawa; Yasushi Kakimoto; Takashi Masuoka

Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron

Kohei Ito, Ryohei Muramoto, Isamu Shiozawa, Yasushi Kakimoto, Takashi Masuoka

Hydrogen Utilization Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.

Original language	English
Title of host publication	Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Pages	2099-2103
Number of pages	5
Volume	PART C
Publication status	Published - 2006
Event	ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 - San Francisco, CA, United States Duration: Jul 17 2005 → Jul 22 2005

Other

Other	ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
Country	United States
City	San Francisco, CA
Period	7/17/05 → 7/22/05

All Science Journal Classification (ASJC) codes

Engineering(all)

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Ito, K., Muramoto, R., Shiozawa, I., Kakimoto, Y., & Masuoka, T. (2006). Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 (Vol. PART C, pp. 2099-2103)

Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. / Ito, Kohei; Muramoto, Ryohei; Shiozawa, Isamu; Kakimoto, Yasushi; Masuoka, Takashi.

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. p. 2099-2103.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Ito, K, Muramoto, R, Shiozawa, I, Kakimoto, Y & Masuoka, T 2006, Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. in Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. vol. PART C, pp. 2099-2103, ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, San Francisco, CA, United States, 7/17/05.

Ito K, Muramoto R, Shiozawa I, Kakimoto Y, Masuoka T. Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. In Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C. 2006. p. 2099-2103

Ito, Kohei ; Muramoto, Ryohei ; Shiozawa, Isamu ; Kakimoto, Yasushi ; Masuoka, Takashi. / Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron. Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005. Vol. PART C 2006. pp. 2099-2103

@inproceedings{57d14072c75f4024b6a89b7582e62fd5,

title = "Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron",

abstract = "By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.",

author = "Kohei Ito and Ryohei Muramoto and Isamu Shiozawa and Yasushi Kakimoto and Takashi Masuoka",

year = "2006",

language = "English",

isbn = "0791842002",

volume = "PART C",

pages = "2099--2103",

booktitle = "Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005",

note = "ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005 ; Conference date: 17-07-2005 Through 22-07-2005",

}

TY - GEN

T1 - Numerical analysis of electro-thermal phenomena in metal by boltzmann transport equation for electron

AU - Ito, Kohei

AU - Muramoto, Ryohei

AU - Shiozawa, Isamu

AU - Kakimoto, Yasushi

AU - Masuoka, Takashi

PY - 2006

Y1 - 2006

N2 - By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.

AB - By the development of micro-fabrication technology, much smaller-size electronic devices will be soon available. In such a smaller device, a non-equilibrium state might appear in metal and/or semiconductor. In this case, it is difficult to estimate the device performance by the macroscopic transport equations that assume quasi-equilibrium distribution. We are developing a numerical simulation based on Boltzmann transport equation (BTE), which can analyze thermal and electric phenomena even when the state is far from equilibrium. In this study, we show a new formulation of BTE for free electron in metal and its calculation result: the thermoelectric power obtained agreed with that of experimental value: the heat flux derived by the non-equilibrium distribution was two-orders small than that estimated by thermal conductivity.

UR - http://www.scopus.com/inward/record.url?scp=32844472671&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=32844472671&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:32844472671

SN - 0791842002

VL - PART C

SP - 2099

EP - 2103

BT - Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

T2 - ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005

Y2 - 17 July 2005 through 22 July 2005

ER -