Numerical Analysis of Heat Transport Phenomena during the Collision of a Liquid Droplet on a Substrate

Jun Fukai, Yuji Shiiba, Mitsuru Tanaka, Osamu Miyatake

Research output: Contribution to journalArticle

Abstract

Fluid flow and heat transport phenomena of a liquid droplet colliding with a substrate are modeled. The fluid flow model accounts for the deformation of the droplet. The heat transfer model accounts for heat transfers within the droplet and the substrate. The mathematical models are numerically solved using a finite element method. Calculations are performed for the case where a molten tin droplet impacts various substrates. As a result, the following conclusions were obtained: 1) The periphery of the spreading droplet is more rapidly cooled than the central region. 2) The effects of initial temperatures and thermophysical properties of the droplet and the substrate on the temperature at the liquid-solid interface can be assessed using the analytical solution for the case where two infinite solids of different initial temperatures are contacted. 3) Heat transfer rate at the liquid-solid interface is dominated by the heat conduction within the substrate. 4) The heat transfer rate at the liquid-solid interface increases with increasing preimpact velocity of the droplet. The increase of the heat transfer rate is due to enlargement of the heat transfer area rather than improvement of convectional heat transfer within the droplet.

Original languageEnglish
Pages (from-to)878-884
Number of pages7
Journalkagaku kogaku ronbunshu
Volume23
Issue number6
DOIs
Publication statusPublished - Jan 1 1997

All Science Journal Classification (ASJC) codes

  • Chemistry(all)
  • Chemical Engineering(all)

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