TY - GEN
T1 - Observation of residual surface charge distribution inside an artificial air-filled void due to partial discharge activities at room and liquid nitrogen temperatures
AU - Kurihara, T.
AU - Suehiro, J.
AU - Hara, M.
N1 - Copyright:
Copyright 2008 Elsevier B.V., All rights reserved.
PY - 2004
Y1 - 2004
N2 - Partial discharge (PD) characteristics within an artificial air-filled void contained in a solid insulator were experimentally investigated under 60 Hz ac voltages at liquid nitrogen temperature (77 K) and room temperature of 298 K. The results show that the first PD inception voltage at 77 K is about twice higher than that at 298 K while successive values at both temperatures are almost the same. The results also show that PD charge magnitude noticeably decreases and PD pulse number remarkably increases with the decrease in the temperature from 298 K to 77 K. The latter results are further discussed based on the observed remarkable decrease in the charged area by a single PD on an inner void surface with the decrease in the temperature.
AB - Partial discharge (PD) characteristics within an artificial air-filled void contained in a solid insulator were experimentally investigated under 60 Hz ac voltages at liquid nitrogen temperature (77 K) and room temperature of 298 K. The results show that the first PD inception voltage at 77 K is about twice higher than that at 298 K while successive values at both temperatures are almost the same. The results also show that PD charge magnitude noticeably decreases and PD pulse number remarkably increases with the decrease in the temperature from 298 K to 77 K. The latter results are further discussed based on the observed remarkable decrease in the charged area by a single PD on an inner void surface with the decrease in the temperature.
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M3 - Conference contribution
AN - SCOPUS:15844391273
SN - 0780383486
T3 - Proceedings of the 2004 IEEE International Conference on Solid Dielectrics ICSD 2004
SP - 308
EP - 311
BT - Proceedings of the 2004 IEEE International Conference on Solid Dielectrics ICSD 2004
T2 - Proceedings of the 2004 IEEE International Conference on Solid Dielectrics ICSD 2004
Y2 - 5 July 2004 through 9 July 2004
ER -