TY - GEN
T1 - On-Chip Cavitation Generation Based on Ultra-High-Speed Flow Control
AU - Kasai, Yusuke
AU - Sakuma, Shinya
AU - Arai, Fumihito
N1 - Funding Information:
This work was supported by Grant-in-Aid for JSPS Research Fellow (18J15242).
Publisher Copyright:
© 2019 IEEE.
PY - 2019/6
Y1 - 2019/6
N2 - We present an on-chip cavitation generation system based on ultra-high-speed flow control. Novelties are that: (1) cavitation is observable in a high-rigidity microfluidic chip consisting of glass-Si-glass layered substrates, and (2) cavitation can be generated only based on flow control. As results, constructing on-chip membrane pumps for ultrahigh-speed flow, we succeeded in the on-chip cavitation generation by ultra-high-speed flow control and observing its phenomenon on a microscope. In addition, we found that the result corresponded to the Finite Element Method (FEM) analysis which showed that the cavitation occurred at the area where the dynamic pressure was lower than the saturated vaper pressure of water.
AB - We present an on-chip cavitation generation system based on ultra-high-speed flow control. Novelties are that: (1) cavitation is observable in a high-rigidity microfluidic chip consisting of glass-Si-glass layered substrates, and (2) cavitation can be generated only based on flow control. As results, constructing on-chip membrane pumps for ultrahigh-speed flow, we succeeded in the on-chip cavitation generation by ultra-high-speed flow control and observing its phenomenon on a microscope. In addition, we found that the result corresponded to the Finite Element Method (FEM) analysis which showed that the cavitation occurred at the area where the dynamic pressure was lower than the saturated vaper pressure of water.
UR - http://www.scopus.com/inward/record.url?scp=85071929031&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85071929031&partnerID=8YFLogxK
U2 - 10.1109/TRANSDUCERS.2019.8808671
DO - 10.1109/TRANSDUCERS.2019.8808671
M3 - Conference contribution
AN - SCOPUS:85071929031
T3 - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
SP - 801
EP - 804
BT - 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII
Y2 - 23 June 2019 through 27 June 2019
ER -