TY - GEN
T1 - On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector
AU - Yamashita, Yu
AU - Ichikawa, Keita
AU - Basaki, Natsumi
AU - Sakuma, Shinya
AU - Yamanishi, Yoko
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant Number JP19H02113.
Publisher Copyright:
© 2021 IEEE.
PY - 2021/1/25
Y1 - 2021/1/25
N2 - We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.
AB - We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.
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U2 - 10.1109/MEMS51782.2021.9375399
DO - 10.1109/MEMS51782.2021.9375399
M3 - Conference contribution
AN - SCOPUS:85103463742
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 678
EP - 680
BT - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Y2 - 25 January 2021 through 29 January 2021
ER -