On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

Yu Yamashita; Keita Ichikawa; Natsumi Basaki; Shinya Sakuma; Yoko Yamanishi

doi:10.1109/MEMS51782.2021.9375399

On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

Yu Yamashita, Keita Ichikawa, Natsumi Basaki, Shinya Sakuma, Yoko Yamanishi

Mechanical Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.

Original language	English
Title of host publication	34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	678-680
Number of pages	3
ISBN (Electronic)	9781665419123
DOIs	https://doi.org/10.1109/MEMS51782.2021.9375399
Publication status	Published - Jan 25 2021
Event	34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States Duration: Jan 25 2021 → Jan 29 2021

Publication series

Name	Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume	2021-January
ISSN (Print)	1084-6999

Conference

Conference	34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
Country/Territory	United States
City	Virtual, Gainesville
Period	1/25/21 → 1/29/21

All Science Journal Classification (ASJC) codes

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Mechanical Engineering
Electrical and Electronic Engineering

Access to Document

10.1109/MEMS51782.2021.9375399

Cite this

Yamashita, Y., Ichikawa, K., Basaki, N., Sakuma, S., & Yamanishi, Y. (2021). On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector. In 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 (pp. 678-680). [9375399] (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2021-January). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMS51782.2021.9375399

On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector. / Yamashita, Yu; Ichikawa, Keita; Basaki, Natsumi; Sakuma, Shinya ; Yamanishi, Yoko.

34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. p. 678-680 9375399 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS); Vol. 2021-January).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Yamashita, Y, Ichikawa, K, Basaki, N, Sakuma, S & Yamanishi, Y 2021, On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector. in 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021., 9375399, Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS), vol. 2021-January, Institute of Electrical and Electronics Engineers Inc., pp. 678-680, 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021, Virtual, Gainesville, United States, 1/25/21. https://doi.org/10.1109/MEMS51782.2021.9375399

Yamashita Y, Ichikawa K, Basaki N, Sakuma S , Yamanishi Y. On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector. In 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021. Institute of Electrical and Electronics Engineers Inc. 2021. p. 678-680. 9375399. (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)). https://doi.org/10.1109/MEMS51782.2021.9375399

Yamashita, Yu ; Ichikawa, Keita ; Basaki, Natsumi ; Sakuma, Shinya ; Yamanishi, Yoko. / On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector. 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021. Institute of Electrical and Electronics Engineers Inc., 2021. pp. 678-680 (Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)).

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title = "On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector",

abstract = "We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.",

author = "Yu Yamashita and Keita Ichikawa and Natsumi Basaki and Shinya Sakuma and Yoko Yamanishi",

note = "Funding Information: This work was supported by JSPS KAKENHI Grant Number JP19H02113. Publisher Copyright: {\textcopyright} 2021 IEEE.; 34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 ; Conference date: 25-01-2021 Through 29-01-2021",

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AU - Yamashita, Yu

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AU - Yamanishi, Yoko

PY - 2021/1/25

Y1 - 2021/1/25

N2 - We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.

AB - We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.

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On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

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