On-Demand Metal Deposition Utilizing a Core-Shell Micro-Plasma-Bubble Injector

Yu Yamashita, Keita Ichikawa, Natsumi Basaki, Shinya Sakuma, Yoko Yamanishi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We propose an innovative concept, On-demand metal deposition by micro-plasma bubble which enable us to fabricate microelectrode with no limit by the conductivity and shape of target. We confirm a micro-plasma bubble generation by local discharge which is a key mechanism of our proposed method. The micro-plasma bubble has strong reduction effect, and we achieved deposition of the copper at and arbitrary position on glass, silicon wafer and nitrile rubber by reducing the copper ions in the solution. According to these results, we proved the proposed method is enable to be applied to any objects regardless of the conductivity and surface shape of substrate.

Original languageEnglish
Title of host publication34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages678-680
Number of pages3
ISBN (Electronic)9781665419123
DOIs
Publication statusPublished - Jan 25 2021
Event34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021 - Virtual, Gainesville, United States
Duration: Jan 25 2021Jan 29 2021

Publication series

NameProceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
Volume2021-January
ISSN (Print)1084-6999

Conference

Conference34th IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2021
CountryUnited States
CityVirtual, Gainesville
Period1/25/211/29/21

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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