One-sided directional slot antenna with impedance matching circuit for 3D packaging

Haruichi Kanaya; Naoto Iizasa; Tomoki Oda

doi:10.1109/EPTC.2014.7028409

One-sided directional slot antenna with impedance matching circuit for 3D packaging

Haruichi Kanaya, Naoto Iizasa, Tomoki Oda

Integrated Electronic Systems

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

This paper presents the design and implementation of onesided directional slot antenna with impedance matching circuit for 2.4 GHz application. The impedance matching circuit is realized by applying 1-stage band-pass filter (BPF). This proposed antenna has 3-layer structures. Antenna and impedance matching section is on the top layer. Ground plane of the RF circuit is on the bottom layer. Floating metal layer is inserted between the top and bottom layers. Floating metal layer generate the one-sided directional radiation. We fabricated this antenna on FR4 substrate and measured the frequency characteristics. Also, commercialized 2.4GHz band transmitter is attached on the bottom of the proposed antenna.

Original language	English
Title of host publication	Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	734-737
Number of pages	4
ISBN (Electronic)	9781479969944
DOIs	https://doi.org/10.1109/EPTC.2014.7028409
Publication status	Published - Jan 30 2014
Event	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 - Singapore, Singapore Duration: Dec 3 2014 → Dec 5 2014

Other

Other	2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014
Country	Singapore
City	Singapore
Period	12/3/14 → 12/5/14

All Science Journal Classification (ASJC) codes

Electrical and Electronic Engineering

Access to Document

10.1109/EPTC.2014.7028409

Fingerprint Dive into the research topics of 'One-sided directional slot antenna with impedance matching circuit for 3D packaging'. Together they form a unique fingerprint.

Cite this

One-sided directional slot antenna with impedance matching circuit for 3D packaging. / Kanaya, Haruichi; Iizasa, Naoto; Oda, Tomoki.

Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014. Institute of Electrical and Electronics Engineers Inc., 2014. p. 734-737 7028409.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Kanaya, H, Iizasa, N & Oda, T 2014, One-sided directional slot antenna with impedance matching circuit for 3D packaging. in Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014., 7028409, Institute of Electrical and Electronics Engineers Inc., pp. 734-737, 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014, Singapore, Singapore, 12/3/14. https://doi.org/10.1109/EPTC.2014.7028409

@inproceedings{9a4fd005a63c493b878db596dd8a4174,

title = "One-sided directional slot antenna with impedance matching circuit for 3D packaging",

abstract = "This paper presents the design and implementation of onesided directional slot antenna with impedance matching circuit for 2.4 GHz application. The impedance matching circuit is realized by applying 1-stage band-pass filter (BPF). This proposed antenna has 3-layer structures. Antenna and impedance matching section is on the top layer. Ground plane of the RF circuit is on the bottom layer. Floating metal layer is inserted between the top and bottom layers. Floating metal layer generate the one-sided directional radiation. We fabricated this antenna on FR4 substrate and measured the frequency characteristics. Also, commercialized 2.4GHz band transmitter is attached on the bottom of the proposed antenna.",

author = "Haruichi Kanaya and Naoto Iizasa and Tomoki Oda",

year = "2014",

month = jan,

day = "30",

doi = "10.1109/EPTC.2014.7028409",

language = "English",

pages = "734--737",

booktitle = "Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

address = "United States",

note = "2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014 ; Conference date: 03-12-2014 Through 05-12-2014",

}

TY - GEN

T1 - One-sided directional slot antenna with impedance matching circuit for 3D packaging

AU - Kanaya, Haruichi

AU - Iizasa, Naoto

AU - Oda, Tomoki

PY - 2014/1/30

Y1 - 2014/1/30

N2 - This paper presents the design and implementation of onesided directional slot antenna with impedance matching circuit for 2.4 GHz application. The impedance matching circuit is realized by applying 1-stage band-pass filter (BPF). This proposed antenna has 3-layer structures. Antenna and impedance matching section is on the top layer. Ground plane of the RF circuit is on the bottom layer. Floating metal layer is inserted between the top and bottom layers. Floating metal layer generate the one-sided directional radiation. We fabricated this antenna on FR4 substrate and measured the frequency characteristics. Also, commercialized 2.4GHz band transmitter is attached on the bottom of the proposed antenna.

AB - This paper presents the design and implementation of onesided directional slot antenna with impedance matching circuit for 2.4 GHz application. The impedance matching circuit is realized by applying 1-stage band-pass filter (BPF). This proposed antenna has 3-layer structures. Antenna and impedance matching section is on the top layer. Ground plane of the RF circuit is on the bottom layer. Floating metal layer is inserted between the top and bottom layers. Floating metal layer generate the one-sided directional radiation. We fabricated this antenna on FR4 substrate and measured the frequency characteristics. Also, commercialized 2.4GHz band transmitter is attached on the bottom of the proposed antenna.

UR - http://www.scopus.com/inward/record.url?scp=84946689956&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84946689956&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2014.7028409

DO - 10.1109/EPTC.2014.7028409

M3 - Conference contribution

AN - SCOPUS:84946689956

SP - 734

EP - 737

BT - Proceedings of the 16th Electronics Packaging Technology Conference, EPTC 2014

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 2014 16th IEEE Electronics Packaging Technology Conference, EPTC 2014

Y2 - 3 December 2014 through 5 December 2014

ER -