Optical micro sensors integration and application

Nobutomo Morita, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
Subtitle of host publication"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3-6
Number of pages4
ISBN (Electronic)9781479961955
DOIs
Publication statusPublished - Jan 13 2015
Event2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan
Duration: Nov 4 2014Nov 6 2014

Publication series

NameIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

Other

Other2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CountryJapan
CityKyoto
Period11/4/1411/6/14

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Morita, N., & Sawada, R. (2015). Optical micro sensors integration and application. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 3-6). [7009595] (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009595