Optical micro sensors integration and application

Nobutomo Morita, Renshi Sawada

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

Original languageEnglish
Title of host publicationIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium
Subtitle of host publication"Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages3-6
Number of pages4
ISBN (Electronic)9781479961955
DOIs
Publication statusPublished - Jan 13 2015
Event2014 4th IEEE CPMT Symposium Japan, ICSJ 2014 - Kyoto, Japan
Duration: Nov 4 2014Nov 6 2014

Publication series

NameIEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

Other

Other2014 4th IEEE CPMT Symposium Japan, ICSJ 2014
CountryJapan
CityKyoto
Period11/4/1411/6/14

Fingerprint

MEMS
Packaging
Sensors
Laser Doppler velocimeters
Optical sensors
Optical devices
Electric power utilization
Blood
Silicon
Electrodes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

Cite this

Morita, N., & Sawada, R. (2015). Optical micro sensors integration and application. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014 (pp. 3-6). [7009595] (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICSJ.2014.7009595

Optical micro sensors integration and application. / Morita, Nobutomo; Sawada, Renshi.

IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. p. 3-6 7009595 (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Morita, N & Sawada, R 2015, Optical micro sensors integration and application. in IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014., 7009595, IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014, Institute of Electrical and Electronics Engineers Inc., pp. 3-6, 2014 4th IEEE CPMT Symposium Japan, ICSJ 2014, Kyoto, Japan, 11/4/14. https://doi.org/10.1109/ICSJ.2014.7009595
Morita N, Sawada R. Optical micro sensors integration and application. In IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc. 2015. p. 3-6. 7009595. (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014). https://doi.org/10.1109/ICSJ.2014.7009595
Morita, Nobutomo ; Sawada, Renshi. / Optical micro sensors integration and application. IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 3-6 (IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014).
@inproceedings{6ef1306e9e0149a3a71d3ae4b3c47324,
title = "Optical micro sensors integration and application",
abstract = "Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.",
author = "Nobutomo Morita and Renshi Sawada",
year = "2015",
month = "1",
day = "13",
doi = "10.1109/ICSJ.2014.7009595",
language = "English",
series = "IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: {"}Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics{"}, ICSJ 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "3--6",
booktitle = "IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium",
address = "United States",

}

TY - GEN

T1 - Optical micro sensors integration and application

AU - Morita, Nobutomo

AU - Sawada, Renshi

PY - 2015/1/13

Y1 - 2015/1/13

N2 - Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

AB - Integrating and miniaturizing optical equipment confers many advantages: low weight, low power consumption, portability, and ease to embed. However, integration and miniaturization presents difficulties because optical elements in the equipment need precise alignment and packaging. We have previously developed several types of optical micro-sensors, including micro-electromechanical systems (MEMS) blood flow sensors, micro-optical encoders, and a micro-laser Doppler velocimeter. Cavities containing empty space and mirrors, through-silicon vias, and three-dimensional electrodes enable our sensors achieve wafer-level packaging of the optical MEMS chip. We introduce the integration of our developed miniaturized optical sensors and several applications.

UR - http://www.scopus.com/inward/record.url?scp=84922817006&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84922817006&partnerID=8YFLogxK

U2 - 10.1109/ICSJ.2014.7009595

DO - 10.1109/ICSJ.2014.7009595

M3 - Conference contribution

T3 - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium: "Packaging for Future Optoelectronics, RF/High-Speed Electronics and Bioelectronics", ICSJ 2014

SP - 3

EP - 6

BT - IEEE CPMT Symposium Japan 2014 - The Leading International Components, Packaging, and Manufacturing Technology Symposium

PB - Institute of Electrical and Electronics Engineers Inc.

ER -