Outline of Micromachining Technologies (1)

Renshi Sawada

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	495-499
Number of pages	5
Journal	Journal of Japan Institute of Electronics Packaging
Volume	10
Issue number	6
DOIs	https://doi.org/10.5104/jiep.10.495
Publication status	Published - 2007

All Science Journal Classification (ASJC) codes

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title = "Outline of Micromachining Technologies (1)",

author = "Renshi Sawada",

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