Outline of Micromachining Technologies (1)

Renshi Sawada

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Pages (from-to)495-499
    Number of pages5
    JournalJournal of Japan Institute of Electronics Packaging
    Volume10
    Issue number6
    DOIs
    Publication statusPublished - Jan 1 2007

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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