Outline of Micromachining Technologies (2)

Renshi Sawada

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)578-582
Number of pages5
JournalJournal of Japan Institute of Electronics Packaging
Volume10
Issue number7
DOIs
Publication statusPublished - Jan 1 2007

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All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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