Outline of Micromachining Technologies (2)

Renshi Sawada

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Pages (from-to)578-582
    Number of pages5
    JournalJournal of Japan Institute of Electronics Packaging
    Volume10
    Issue number7
    DOIs
    Publication statusPublished - 2007

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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