Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards

H. Sugahara, S. Kimura, K. Murata, E. Sano

Research output: Contribution to conferencePaper

3 Citations (Scopus)

Abstract

The development of a key technology for realizing small, low-cost integrated circuits (IC) modules for over-40-Gb/s optical communication systems was described. The technology mainly featured four-layer resin printed circuit boards (PCB) and 8-mm-square leadless chip carriers (LCC). Application of this technology was to build a prototype multichip 1:4 DEMUX module operating at 45 Gb/s.

Original languageEnglish
Pages255-258
Number of pages4
Publication statusPublished - Jan 1 2001
Externally publishedYes
Event23rd Annual GaAs IC Symposium 2001 - Baltimore, MD, United States
Duration: Oct 21 2001Oct 24 2001

Conference

Conference23rd Annual GaAs IC Symposium 2001
CountryUnited States
CityBaltimore, MD
Period10/21/0110/24/01

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Sugahara, H., Kimura, S., Murata, K., & Sano, E. (2001). Over-40-Gb/s IC module technology using 8-mm-square leadless chip carrier packages mounted on four-layer resin printed circuit boards. 255-258. Paper presented at 23rd Annual GaAs IC Symposium 2001, Baltimore, MD, United States.