Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface

Noboru Iwasaki, Mitsuaki Yanagibashi, Hideki Tsunetsugu, Kazutoshi Kato, Fuminori Ishitsuka, Masakaze Hosoya, Hiroyuki Kikuchi

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A compact 40-Gb/s optical receiver module with an MU-connector interface was developed. To improve the electrical performance of the module, the CPW patterns of WG-PD and of the preamplifier IC in the facing area of the flip-chip structure were optimized for impedance matching. Furthermore, an impedance-matched film carrier was used to connect the preamplifier IC to an electrical coaxial connector for electrical signal output. Measurements showed a 3-dB down bandwidth of the optical/electrical response of at least 50 GHz and a clear open eye pattern for a 40-Gb/s NRZ signal input.

Original languageEnglish
Pages (from-to)429-433
Number of pages5
JournalIEEE Transactions on Advanced Packaging
Volume24
Issue number4
DOIs
Publication statusPublished - Nov 1 2001
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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    Iwasaki, N., Yanagibashi, M., Tsunetsugu, H., Kato, K., Ishitsuka, F., Hosoya, M., & Kikuchi, H. (2001). Packaging technology for 40-Gb/s optical receiver module with an MU-connector interface. IEEE Transactions on Advanced Packaging, 24(4), 429-433. https://doi.org/10.1109/6040.982825