Partial discharge degradation of solid insulators with an air-filled void at liquid nitrogen temperature

Shin ichiro Tsuru, Takumi Mine, Junya Suehiro, Masanori Hara

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Degradation and Lifetime characteristics of solid insulators with an artificial air-filled void was investigated experimentally at liquid nitrogen temperature. As a result, it was found that the lifetime of a test sample decreased suddenly with increase in applied voltage. Observation of the PD characteristics showed that the decrease in lifetime at a higher applied voltage had a close relationship with the PD activity. The void surface subjected to the PDs was observed with SEM, and the degradation mechanism was discussed taking the experimental results into consideration.

Original languageEnglish
Title of host publicationIEE Conference Publication
PublisherIEE
Pages4.369.P2-4.372.P2
Edition467
ISBN (Print)0852967195
Publication statusPublished - Dec 1 1999
EventProceedings of the 1999 11th International Symposium on 'High Voltage Engineering' (ish99) - London, UK
Duration: Aug 23 1999Aug 27 1999

Publication series

NameIEE Conference Publication
Number467
Volume4
ISSN (Print)0537-9989

Other

OtherProceedings of the 1999 11th International Symposium on 'High Voltage Engineering' (ish99)
CityLondon, UK
Period8/23/998/27/99

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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  • Cite this

    Tsuru, S. I., Mine, T., Suehiro, J., & Hara, M. (1999). Partial discharge degradation of solid insulators with an air-filled void at liquid nitrogen temperature. In IEE Conference Publication (467 ed., pp. 4.369.P2-4.372.P2). (IEE Conference Publication; Vol. 4, No. 467). IEE.