Passivation of electrically active defects in Ge-Rich SiGe-on-insulator by Al2O3 deposition and subsequent post-deposition annealing

Haigui Yang, Masatoshi Iyota, Shogo Ikeura, Dong Wang, Hiroshi Nakashima

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Abstract

Al2O3 deposition and subsequent post-deposition annealing (Al2O3-PDA) is proposed as an effective method to passivate electrically active defects in Ge-rich SiGe-on-insulator (SGOI) substrates, which were fabricated using Ge condensation. We found that Al 2O3-PDA could not only suppress the surface reaction during Al-PDA, but could also reduce the defect-induced hole concentration in Ge-rich SGOI, which was in the range of 1016-1018 cm -3 before Al2O3-PDA, by approximately one order of magnitude. Al2O3-PDA greatly improves the electrical characteristics of a back-gate metal-oxide-semiconductor field-effect transistor fabricated on Ge-rich SGOI.

Original languageEnglish
Article number071302
JournalApplied Physics Express
Volume3
Issue number7
DOIs
Publication statusPublished - Jul 1 2010

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All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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