Passive alignment and mounting of LiNbO3 waveguide chips on Si substrates by low-temperature solid-state bonding of Au

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Tetsuya Kawanishi

Research output: Contribution to journalArticlepeer-review

37 Citations (Scopus)

Fingerprint Dive into the research topics of 'Passive alignment and mounting of LiNbO<sub>3</sub> waveguide chips on Si substrates by low-temperature solid-state bonding of Au'. Together they form a unique fingerprint.

Physics & Astronomy

Engineering & Materials Science