Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing

Michio Uneda; Tatsunori Omote; Ken Ichi Ishikawa; Koichiro Ichikawa; Toshiro Doi; Syuhei Kurokawa; Osamu Ohnishi

doi:10.1143/JJAP.51.05EF02

Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing

Michio Uneda, Tatsunori Omote, Ken Ichi Ishikawa, Koichiro Ichikawa, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi

Manufacturing Process

Research output: Contribution to journal › Article

2 Citations (Scopus)

Abstract

In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.

Original language	English
Article number	05EF02
Journal	Japanese journal of applied physics
Volume	51
Issue number	5 PART 2
DOIs	https://doi.org/10.1143/JJAP.51.05EF02
Publication status	Published - May 1 2012

All Science Journal Classification (ASJC) codes

Engineering(all)
Physics and Astronomy(all)

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10.1143/JJAP.51.05EF02

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Uneda, M., Omote, T., Ishikawa, K. I., Ichikawa, K., Doi, T., Kurokawa, S., & Ohnishi, O. (2012). Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing. Japanese journal of applied physics, 51(5 PART 2), [05EF02]. https://doi.org/10.1143/JJAP.51.05EF02

Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing. / Uneda, Michio; Omote, Tatsunori; Ishikawa, Ken Ichi; Ichikawa, Koichiro; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu.

In: Japanese journal of applied physics, Vol. 51, No. 5 PART 2, 05EF02, 01.05.2012.

Research output: Contribution to journal › Article

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AU - Kurokawa, Syuhei

AU - Ohnishi, Osamu

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