Abstract
In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.
| Original language | English |
|---|---|
| Article number | 05EF02 |
| Journal | Japanese journal of applied physics |
| Volume | 51 |
| Issue number | 5 PART 2 |
| DOIs | |
| Publication status | Published - May 1 2012 |
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All Science Journal Classification (ASJC) codes
- Engineering(all)
- Physics and Astronomy(all)
Cite this
Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing. / Uneda, Michio; Omote, Tatsunori; Ishikawa, Ken Ichi; Ichikawa, Koichiro; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu.
In: Japanese journal of applied physics, Vol. 51, No. 5 PART 2, 05EF02, 01.05.2012.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing
AU - Uneda, Michio
AU - Omote, Tatsunori
AU - Ishikawa, Ken Ichi
AU - Ichikawa, Koichiro
AU - Doi, Toshiro
AU - Kurokawa, Syuhei
AU - Ohnishi, Osamu
PY - 2012/5/1
Y1 - 2012/5/1
N2 - In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.
AB - In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.
UR - http://www.scopus.com/inward/record.url?scp=84861515833&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84861515833&partnerID=8YFLogxK
U2 - 10.1143/JJAP.51.05EF02
DO - 10.1143/JJAP.51.05EF02
M3 - Article
AN - SCOPUS:84861515833
VL - 51
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
SN - 0021-4922
IS - 5 PART 2
M1 - 05EF02
ER -