Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing

Michio Uneda, Tatsunori Omote, Ken Ichi Ishikawa, Koichiro Ichikawa, Toshiro Doi, Syuhei Kurokawa, Osamu Ohnishi

Research output: Contribution to journalArticle

2 Citations (Scopus)

Abstract

In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.

Original languageEnglish
Article number05EF02
JournalJapanese journal of applied physics
Volume51
Issue number5 PART 2
DOIs
Publication statusPublished - May 1 2012

Fingerprint

Chemical mechanical polishing
conditioning
polishing
evaluation
textures
Processing
Textures
regeneration
mesh

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing. / Uneda, Michio; Omote, Tatsunori; Ishikawa, Ken Ichi; Ichikawa, Koichiro; Doi, Toshiro; Kurokawa, Syuhei; Ohnishi, Osamu.

In: Japanese journal of applied physics, Vol. 51, No. 5 PART 2, 05EF02, 01.05.2012.

Research output: Contribution to journalArticle

Uneda, Michio ; Omote, Tatsunori ; Ishikawa, Ken Ichi ; Ichikawa, Koichiro ; Doi, Toshiro ; Kurokawa, Syuhei ; Ohnishi, Osamu. / Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing. In: Japanese journal of applied physics. 2012 ; Vol. 51, No. 5 PART 2.
@article{2682f5a24ad74a6fbfa025f928f10d7e,
title = "Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing",
abstract = "In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.",
author = "Michio Uneda and Tatsunori Omote and Ishikawa, {Ken Ichi} and Koichiro Ichikawa and Toshiro Doi and Syuhei Kurokawa and Osamu Ohnishi",
year = "2012",
month = "5",
day = "1",
doi = "10.1143/JJAP.51.05EF02",
language = "English",
volume = "51",
journal = "Japanese Journal of Applied Physics",
issn = "0021-4922",
number = "5 PART 2",

}

TY - JOUR

T1 - Performance evaluation method of chemical mechanical polishing pad conditioner using digital image correlation processing

AU - Uneda, Michio

AU - Omote, Tatsunori

AU - Ishikawa, Ken Ichi

AU - Ichikawa, Koichiro

AU - Doi, Toshiro

AU - Kurokawa, Syuhei

AU - Ohnishi, Osamu

PY - 2012/5/1

Y1 - 2012/5/1

N2 - In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.

AB - In chemical mechanical polishing (CMP), conditioning is generally used for the regeneration of the pad surface texture. Currently, the performance evaluation of conditioners depends on the user's experience so that it is important to develop a novel quantitative evaluation method for conditioner performance. In this paper, we propose a novel evaluation method for conditioner performance using digital image correlation (DIC) processing. The proposed method can measure the in-plane micro-deformation distribution of the pad surface texture by conditioning. It is found that a pad surface deforms over 40 μm with conditioning and that the in-plane deformation value increases with a decrease in the mesh size of conditioner grains.

UR - http://www.scopus.com/inward/record.url?scp=84861515833&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84861515833&partnerID=8YFLogxK

U2 - 10.1143/JJAP.51.05EF02

DO - 10.1143/JJAP.51.05EF02

M3 - Article

AN - SCOPUS:84861515833

VL - 51

JO - Japanese Journal of Applied Physics

JF - Japanese Journal of Applied Physics

SN - 0021-4922

IS - 5 PART 2

M1 - 05EF02

ER -