Performance evaluation of 3D stacked multi-core processors with temperature consideration

Takaaki Hanada; Hiroshi Sasaki; Koji Inoue; Kazuaki Murakami

doi:10.1109/3DIC.2012.6263025

Performance evaluation of 3D stacked multi-core processors with temperature consideration

Takaaki Hanada, Hiroshi Sasaki, Koji Inoue, Kazuaki Murakami

Department of I&E Visionaries

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

3D stacked multi-core processor is one of the applications of 3D integration technology. It achieves high bandwidth access to last level cache and allows to increase the number of cores while maintaining the package area. Although, 3D multi-core temperature increases with the number of stacked dies because of the escalating power density and thermal resistivity. Therefore, 3D multi-cores require lower clock frequencies for keeping the temperature under a safe constraint, so that performance is not always improved. In this paper, we evaluate the performance of 3D stacked multi-cores running under temperature constraints, and we show that there is a trade-off between clock frequency and parallel capability.

Original language	English
Title of host publication	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
DOIs	https://doi.org/10.1109/3DIC.2012.6263025
Publication status	Published - Dec 1 2011
Event	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011 - Osaka, Japan Duration: Jan 31 2012 → Feb 2 2012

Publication series

Name	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011

Other

Other	2011 IEEE International 3D Systems Integration Conference, 3DIC 2011
Country	Japan
City	Osaka
Period	1/31/12 → 2/2/12

All Science Journal Classification (ASJC) codes

Control and Systems Engineering

Access to Document

10.1109/3DIC.2012.6263025

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Performance evaluation of 3D stacked multi-core processors with temperature consideration. / Hanada, Takaaki; Sasaki, Hiroshi; Inoue, Koji; Murakami, Kazuaki.

2011 IEEE International 3D Systems Integration Conference, 3DIC 2011. 2011. 6263025 (2011 IEEE International 3D Systems Integration Conference, 3DIC 2011).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Hanada, T, Sasaki, H, Inoue, K & Murakami, K 2011, Performance evaluation of 3D stacked multi-core processors with temperature consideration. in 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011., 6263025, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, 2011 IEEE International 3D Systems Integration Conference, 3DIC 2011, Osaka, Japan, 1/31/12. https://doi.org/10.1109/3DIC.2012.6263025

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