Performance of Sugi lamina impregnated with low-molecular weight phenolic resin

Andi Hermawan, Toru Nakahara, Hiroki Sakagami, Noboru Fujimoto, Kiyotaka Uchikura

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

This study was conducted to evaluate the performance of Sugi lamina impregnated with low-molecular weight phenolic (LMWP) resin using the full cell process followed by curing at high temperature. In this study, penetration of LMWP resin into finger-jointed lamina was examined. Physical and mechanical properties, such as surface hardness, dimensional stability, bending and shear strength of LMWP-resin-treated and untreated lamina were investigated. In addition, the bonding quality and nail-withdrawal resistance of 3-ply assembly specimen made from LMWP-resin-treated and untreated lamina bonded using resorcinol-phenol formaldehyde resin adhesive were also investigated. The main results were as follows: LMWP resin was found to have penetrated sufficiently into finger-jointed lamina. The physical properties of LMWP-resin-treated lamina were found to have improved significantly in comparison with untreated lamina. However, no significant difference was found between LMWP-resin-treated and untreated lamina in terms of their mechanical properties. There was an improvement in bonding quality of the assembly made from LMWP-resin-treated lamina when compared with that made from untreated lamina. In the assembly made from untreated lamina, a significant decrease in nail-withdrawal resistance was observed between dry conditions test and after humidity conditioning test. However, the same tendency was not found in the assembly made from LMWP-resin-treated lamina.

Original languageEnglish
Pages (from-to)299-306
Number of pages8
JournalJournal of Wood Science
Volume59
Issue number4
DOIs
Publication statusPublished - Aug 1 2013

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Phenolic resins
Molecular weight
Nails
Physical properties
phenol-formaldehyde resin
Mechanical properties
Dimensional stability
Formaldehyde
Shear strength
Bending strength
Phenols
Curing
Adhesives
Atmospheric humidity
Resins
Hardness

All Science Journal Classification (ASJC) codes

  • Biomaterials

Cite this

Performance of Sugi lamina impregnated with low-molecular weight phenolic resin. / Hermawan, Andi; Nakahara, Toru; Sakagami, Hiroki; Fujimoto, Noboru; Uchikura, Kiyotaka.

In: Journal of Wood Science, Vol. 59, No. 4, 01.08.2013, p. 299-306.

Research output: Contribution to journalArticle

Hermawan, Andi ; Nakahara, Toru ; Sakagami, Hiroki ; Fujimoto, Noboru ; Uchikura, Kiyotaka. / Performance of Sugi lamina impregnated with low-molecular weight phenolic resin. In: Journal of Wood Science. 2013 ; Vol. 59, No. 4. pp. 299-306.
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