This study was conducted to evaluate the performance of Sugi lamina impregnated with low-molecular weight phenolic (LMWP) resin using the full cell process followed by curing at high temperature. In this study, penetration of LMWP resin into finger-jointed lamina was examined. Physical and mechanical properties, such as surface hardness, dimensional stability, bending and shear strength of LMWP-resin-treated and untreated lamina were investigated. In addition, the bonding quality and nail-withdrawal resistance of 3-ply assembly specimen made from LMWP-resin-treated and untreated lamina bonded using resorcinol-phenol formaldehyde resin adhesive were also investigated. The main results were as follows: LMWP resin was found to have penetrated sufficiently into finger-jointed lamina. The physical properties of LMWP-resin-treated lamina were found to have improved significantly in comparison with untreated lamina. However, no significant difference was found between LMWP-resin-treated and untreated lamina in terms of their mechanical properties. There was an improvement in bonding quality of the assembly made from LMWP-resin-treated lamina when compared with that made from untreated lamina. In the assembly made from untreated lamina, a significant decrease in nail-withdrawal resistance was observed between dry conditions test and after humidity conditioning test. However, the same tendency was not found in the assembly made from LMWP-resin-treated lamina.
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