Abstract
We propose a novel chemical-mechanical polishing (CMP) technique for use as the planarization method in the Cu damascene process for the fabrication of next-generation semiconductors. Water-soluble fullerenol, which has attractive features such as a 1-nm grain size, high water dispersibility in a molecular level and metal free, is used in this technique. Chemical process analysis reveals the chemical and mechanical functions of water-soluble fullerenol molecules as abrasive grains. Experimental results show that Cu-surface roughness was improved from 20 to 0.6 nm RMS by using C60(OH)36 fullerenols as functional molecular abrasive grains to achieve better polishing performance than conventional processes.
| Original language | English |
|---|---|
| Pages (from-to) | 495-498 |
| Number of pages | 4 |
| Journal | CIRP Annals - Manufacturing Technology |
| Volume | 58 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Apr 24 2009 |
Fingerprint
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
- Industrial and Manufacturing Engineering
Cite this
Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces. / Takaya, Y.; Tachika, H.; Hayashi, T.; Kokubo, K.; Suzuki, K.
In: CIRP Annals - Manufacturing Technology, Vol. 58, No. 1, 24.04.2009, p. 495-498.Research output: Contribution to journal › Article
}
TY - JOUR
T1 - Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces
AU - Takaya, Y.
AU - Tachika, H.
AU - Hayashi, T.
AU - Kokubo, K.
AU - Suzuki, K.
PY - 2009/4/24
Y1 - 2009/4/24
N2 - We propose a novel chemical-mechanical polishing (CMP) technique for use as the planarization method in the Cu damascene process for the fabrication of next-generation semiconductors. Water-soluble fullerenol, which has attractive features such as a 1-nm grain size, high water dispersibility in a molecular level and metal free, is used in this technique. Chemical process analysis reveals the chemical and mechanical functions of water-soluble fullerenol molecules as abrasive grains. Experimental results show that Cu-surface roughness was improved from 20 to 0.6 nm RMS by using C60(OH)36 fullerenols as functional molecular abrasive grains to achieve better polishing performance than conventional processes.
AB - We propose a novel chemical-mechanical polishing (CMP) technique for use as the planarization method in the Cu damascene process for the fabrication of next-generation semiconductors. Water-soluble fullerenol, which has attractive features such as a 1-nm grain size, high water dispersibility in a molecular level and metal free, is used in this technique. Chemical process analysis reveals the chemical and mechanical functions of water-soluble fullerenol molecules as abrasive grains. Experimental results show that Cu-surface roughness was improved from 20 to 0.6 nm RMS by using C60(OH)36 fullerenols as functional molecular abrasive grains to achieve better polishing performance than conventional processes.
UR - http://www.scopus.com/inward/record.url?scp=67349110389&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=67349110389&partnerID=8YFLogxK
U2 - 10.1016/j.cirp.2009.03.118
DO - 10.1016/j.cirp.2009.03.118
M3 - Article
AN - SCOPUS:67349110389
VL - 58
SP - 495
EP - 498
JO - CIRP Annals - Manufacturing Technology
JF - CIRP Annals - Manufacturing Technology
SN - 0007-8506
IS - 1
ER -