Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces

Y. Takaya, H. Tachika, T. Hayashi, K. Kokubo, K. Suzuki

Research output: Contribution to journalArticle

22 Citations (Scopus)

Abstract

We propose a novel chemical-mechanical polishing (CMP) technique for use as the planarization method in the Cu damascene process for the fabrication of next-generation semiconductors. Water-soluble fullerenol, which has attractive features such as a 1-nm grain size, high water dispersibility in a molecular level and metal free, is used in this technique. Chemical process analysis reveals the chemical and mechanical functions of water-soluble fullerenol molecules as abrasive grains. Experimental results show that Cu-surface roughness was improved from 20 to 0.6 nm RMS by using C60(OH)36 fullerenols as functional molecular abrasive grains to achieve better polishing performance than conventional processes.

Original languageEnglish
Pages (from-to)495-498
Number of pages4
JournalCIRP Annals - Manufacturing Technology
Volume58
Issue number1
DOIs
Publication statusPublished - Apr 24 2009

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Polishing
Abrasives
Water
Chemical mechanical polishing
Surface roughness
Semiconductor materials
Fabrication
Molecules
Metals

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering
  • Industrial and Manufacturing Engineering

Cite this

Performance of water-soluble fullerenol as novel functional molecular abrasive grain for polishing nanosurfaces. / Takaya, Y.; Tachika, H.; Hayashi, T.; Kokubo, K.; Suzuki, K.

In: CIRP Annals - Manufacturing Technology, Vol. 58, No. 1, 24.04.2009, p. 495-498.

Research output: Contribution to journalArticle

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