Extending the use of the Sn-Cu system to high-temperature solders poses additional challenges as the necessary high Cu content is in a region of the binary phase diagram which is dominated by the peritectic reaction and has the intermetallic compound (IMC) Cu3Sn as the primary phase, which is known to have negative effects on soldering properties. Minor additions of nickel (Ni) have been reported to suppress the formation of Cu3Sn in low Cu content Sn-Cu solder alloys though higher Cu content alloys have not been investigated. As such, the objective of this paper was to investigate the effect of more significant concentrations of Ni on the microstructure of a Sn-30wt%Cu alloy. An initial addition of 2wt%Ni greatly reduced the volume fractions of Cu3Sn and the amount of eutectic present whilst significantly increasing the volume fraction of Cu6Sn5; however, further additions of Ni had a less pronounced affect. The Sn-30wt%Cu morphology was changed from a plate-like structure to a dendritic structure by adding Ni, which would improve solder performance by decreasing the possible crack plane length.