Peritectic reactions and phase transformations of Sn-30wt%cu for high temperature Pb-free soldering applications

Selena Smith, Guang Zeng, Jonathan Read, Stuart D. McDonald, Kazuhiro Nogita

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

Extending the use of the Sn-Cu system to high-temperature solders poses additional challenges as the necessary high Cu content is in a region of the binary phase diagram which is dominated by the peritectic reaction and has the intermetallic compound (IMC) Cu3Sn as the primary phase, which is known to have negative effects on soldering properties. Minor additions of nickel (Ni) have been reported to suppress the formation of Cu3Sn in low Cu content Sn-Cu solder alloys though higher Cu content alloys have not been investigated. As such, the objective of this paper was to investigate the effect of more significant concentrations of Ni on the microstructure of a Sn-30wt%Cu alloy. An initial addition of 2wt%Ni greatly reduced the volume fractions of Cu3Sn and the amount of eutectic present whilst significantly increasing the volume fraction of Cu6Sn5; however, further additions of Ni had a less pronounced affect. The Sn-30wt%Cu morphology was changed from a plate-like structure to a dendritic structure by adding Ni, which would improve solder performance by decreasing the possible crack plane length.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology IV
EditorsMohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Muhammad Faheem Mohd Tahir, Mohd Mustafa Al Bakri Abdullah, Rafiza Abd Razak, Liyana Jamaludin
PublisherTrans Tech Publications Ltd
Pages58-62
Number of pages5
ISBN (Print)9783035710205
DOIs
Publication statusPublished - Jan 1 2016
Externally publishedYes
EventInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015 - Kaohsiung, Taiwan, Province of China
Duration: Dec 4 2015Dec 5 2015

Publication series

NameMaterials Science Forum
Volume857
ISSN (Print)0255-5476
ISSN (Electronic)1662-9752

Other

OtherInternational Conference on Advanced Materials Engineering and Technology, ICAMET 2015
CountryTaiwan, Province of China
CityKaohsiung
Period12/4/1512/5/15

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

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