Plastic deformation behavior of electroformed copper liner of shaped charge at different strain rates

H. Y. Gao, W. H. Tian, A. L. Fan, Q. Sun

Research output: Contribution to journalArticlepeer-review

Abstract

The paper deals with different plastic deformation behavior of electroformed copper liner of shaped charge, deformed at high strain rate (about 1×l07 s-1) and normal strain rate (4×l0-4 s-1). The crystallographic orientation distribution of grains in recovered slugs which had undergone high-strain-rate plastic deformation during explosive detonation was investigated by electron backscattering Kikuchi pattern technique. Cellular structures formed by tangled dislocations and sub-grain boundaries consisting of dislocation arrays were detected in the recovered slugs. Some twins and slip dislocations were observed in specimen deformed at normal strain rate. It was found that dynamic recovery and recrystallization take place during high-strain-rate deformation due to the temperature rising, whereas the conventional slip mechanism operates during deformation at normal strain rate.

Original languageEnglish
Pages (from-to)72-77
Number of pages6
JournalActa Metallurgica Sinica (English Letters)
Volume16
Issue number1
Publication statusPublished - Feb 2003
Externally publishedYes

All Science Journal Classification (ASJC) codes

  • Metals and Alloys
  • Industrial and Manufacturing Engineering

Fingerprint Dive into the research topics of 'Plastic deformation behavior of electroformed copper liner of shaped charge at different strain rates'. Together they form a unique fingerprint.

Cite this