Plating fog generation in the forming of printed circuits by the additive method

S. Sugihara, A. Iwasawa, K. Onose, A. Tanaka, H. Arai, T. Shodai, Shigeto Okada, H. Ohtsuka, S. Tobishima, J. Yamaki

Research output: Contribution to journalArticle

Abstract

Plating fog is often observed when metallizing a latent pattern by electroless copper plating. Metallic elements in the nuclei of plating fog particles are analysed using electron probe microanalysis (EPMA). Silver and iron are invariably found in the particles. The iron is driven into the board during the liquid honing process and reduces silver ions in the photosensitive material to silver metal which causes plating fog. Plating fog also arises from reduced copper particles or generated hydrogen gas bubbles when they are trapped on the unpatterned region. Mechanical stirring accompanied by substrate oscillation is an effective method of avoiding plating fog.

Original languageEnglish
Pages (from-to)1111-1117
Number of pages7
JournalJournal of Applied Electrochemistry
Volume27
Issue number9
DOIs
Publication statusPublished - Jan 1 1997
Externally publishedYes

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All Science Journal Classification (ASJC) codes

  • Chemical Engineering(all)
  • Electrochemistry
  • Materials Chemistry

Cite this

Sugihara, S., Iwasawa, A., Onose, K., Tanaka, A., Arai, H., Shodai, T., ... Yamaki, J. (1997). Plating fog generation in the forming of printed circuits by the additive method. Journal of Applied Electrochemistry, 27(9), 1111-1117. https://doi.org/10.1023/A:1018403130015