Polishing characteristics of glass substrate using new atmosphere control sealed CMP machine (Bell-jar shaped CMP machine) - Effect of Bell-jar processing that aims at reduce of amount of CeO2 slurry use

Tsutomu Yamazaki, Toshiro K. Doi, Syuhei Kurokawa, Osamu Ohnishi, Michio Uneda, Yoji Umezaki, Tao Yin, Hideo Aida

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Engineering & Materials Science