Polishing mechanism of glass substrates with its processing characteristics by cerium oxide and manganese oxide slurries

T. Yamazaki, T. K. Doi, Syuhei Kurokawa, S. Isayama, Y. Umezaki, Y. Matsukawa, H. Kono, Y. Akagami, Y. Yamaguchi, Y. Kawase

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

With an aim to reduce the consumption of cerium oxide (CeO2) used in large quantity for the polishing of glass substrates applied for HDD and display, we have attempted to obtain the processing characteristics of glass substrates by CeO2 slurry. We also paid attention to manganese oxide abrasives to replace cerium oxide abrasives. As a result, we have found Mn 2O3 abrasives potential to replace disappearing CeO 2 for the polishing of glass substrates.

Original languageEnglish
Title of host publicationAdvances in Precision Engineering
Pages141-145
Number of pages5
DOIs
Publication statusPublished - Dec 29 2010
EventICoPE2010 and 13th ICPE International Conference on Precision Engineering - , Singapore
Duration: Jul 28 2010Jul 30 2010

Publication series

NameKey Engineering Materials
Volume447 448
ISSN (Print)1013-9826

Other

OtherICoPE2010 and 13th ICPE International Conference on Precision Engineering
CountrySingapore
Period7/28/107/30/10

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

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    Yamazaki, T., Doi, T. K., Kurokawa, S., Isayama, S., Umezaki, Y., Matsukawa, Y., Kono, H., Akagami, Y., Yamaguchi, Y., & Kawase, Y. (2010). Polishing mechanism of glass substrates with its processing characteristics by cerium oxide and manganese oxide slurries. In Advances in Precision Engineering (pp. 141-145). (Key Engineering Materials; Vol. 447 448). https://doi.org/10.4028/www.scientific.net/KEM.447-448.141