Prediction of E-J characteristics in Bi-2223/Ag tapes at low temperature and high magnetic field

H. Okamoto, Takanobu Kiss, S. Nishimura, Masayoshi Inoue, K. Imamura, M. Takeo, M. Kanazawa

Research output: Contribution to journalConference article

5 Citations (Scopus)

Abstract

Using limited data measurements, the electric field vs. current density (E-J) characteristics of practical Bi-2223/Ag tapes were predicted in a low-temperature and high-magnetic field. This method is based on findings shown in our papers, which describe E-J characteristics according to the percolation model, as a function of temperature, magnetic field and angle of the magnetic field. This method can also estimate critical current density and n-value, given any electric field criterion.

Original languageEnglish
Pages (from-to)3683-3686
Number of pages4
JournalIEEE Transactions on Applied Superconductivity
Volume13
Issue number2 III
DOIs
Publication statusPublished - Jun 1 2003
Event2002 Applied Superconductivity Conference - Houston, TX, United States
Duration: Aug 4 2002Aug 9 2002

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Tapes
tapes
Magnetic fields
predictions
Electric fields
magnetic fields
current density
electric fields
Temperature
critical current
Current density
estimates
temperature

All Science Journal Classification (ASJC) codes

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering

Cite this

Prediction of E-J characteristics in Bi-2223/Ag tapes at low temperature and high magnetic field. / Okamoto, H.; Kiss, Takanobu; Nishimura, S.; Inoue, Masayoshi; Imamura, K.; Takeo, M.; Kanazawa, M.

In: IEEE Transactions on Applied Superconductivity, Vol. 13, No. 2 III, 01.06.2003, p. 3683-3686.

Research output: Contribution to journalConference article

Okamoto, H. ; Kiss, Takanobu ; Nishimura, S. ; Inoue, Masayoshi ; Imamura, K. ; Takeo, M. ; Kanazawa, M. / Prediction of E-J characteristics in Bi-2223/Ag tapes at low temperature and high magnetic field. In: IEEE Transactions on Applied Superconductivity. 2003 ; Vol. 13, No. 2 III. pp. 3683-3686.
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