TY - GEN
T1 - Presentation and Coping Problems of University Ranking in Japan
AU - Oishi, Tetsuya
AU - Ogashiwa, Kahori
AU - Takata, Eiichi
AU - Liu, Saki
AU - Seki, Takahiro
AU - Mori, Masao
N1 - Funding Information:
This work was supported by JSPS KAKENHI Grant Number 18K02705.
Publisher Copyright:
© 2021 IEEE.
PY - 2021
Y1 - 2021
N2 - Most Japanese universities work under intense pressure to maintain or improve their ratings. Therefore, reputation management is very important for them to drive admissions and to increase their brand awareness among the public. Reputation in this case refers to how universities are perceived by each stakeholder. University ranking is an essential tool for reputation management, but how it is used, is unclear. We conducted a questionnaire survey to clarify the concept, and found differences in the activities related to coping with university ranking, their contents, and the issues among universities. In this paper, we present and explain the results of the questionnaire survey.
AB - Most Japanese universities work under intense pressure to maintain or improve their ratings. Therefore, reputation management is very important for them to drive admissions and to increase their brand awareness among the public. Reputation in this case refers to how universities are perceived by each stakeholder. University ranking is an essential tool for reputation management, but how it is used, is unclear. We conducted a questionnaire survey to clarify the concept, and found differences in the activities related to coping with university ranking, their contents, and the issues among universities. In this paper, we present and explain the results of the questionnaire survey.
UR - http://www.scopus.com/inward/record.url?scp=85133189074&partnerID=8YFLogxK
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U2 - 10.1109/IIAI-AAI53430.2021.00050
DO - 10.1109/IIAI-AAI53430.2021.00050
M3 - Conference contribution
AN - SCOPUS:85133189074
T3 - Proceedings - 2021 10th International Congress on Advanced Applied Informatics, IIAI-AAI 2021
SP - 287
EP - 290
BT - Proceedings - 2021 10th International Congress on Advanced Applied Informatics, IIAI-AAI 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 10th International Congress on Advanced Applied Informatics, IIAI-AAI 2021
Y2 - 11 July 2021 through 16 July 2021
ER -