Primary-transient creep and anelastic backflow of pure copper deformed at low temperatures and ultra-low strain rates

Jun jie SHEN, Ken ichi IKEDA, Satoshi Hata, Hideharu Nakashima

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Abstract

Creep and anelastic backflow behaviors of pure copper (4N Cu) with grain size dg=40 μm were investigated at low temperatures of T<0.3Tm (Tm is melting point) and ultra-low creep rates of ɛ˙=1×10−10s−1 by a high strain-resolution measurement (the helicoid spring specimen technique). Analysis of creep data was based on the scaling factors of creep curves instead of the conventional extrapolated steady-state creep rate. Power-law creep equation is suggested to be the best for describing the primary transient creep behavior, because the pre-parameter does not apparently change with elapsed time. The observed anelastic strains are 1/6 of the calculated elastic strains, and linear viscous behavior was identified from the logarithm plot of the anelastic strain rate versus anelastic strain (slope equals 1). Therefore, the creep anelasticity is suggested to be due to the unbowing of there-dimensional network of dislocations.

Original languageEnglish
Pages (from-to)1729-1735
Number of pages7
JournalTransactions of Nonferrous Metals Society of China (English Edition)
Volume26
Issue number7
DOIs
Publication statusPublished - Jul 1 2016

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strain rate
creep
Strain rate
Copper
Creep
copper
anelasticity
steady state creep
logarithms
Temperature
melting points
plots
grain size
slopes
scaling
curves
dislocation
Melting point
power law
melting

All Science Journal Classification (ASJC) codes

  • Condensed Matter Physics
  • Geotechnical Engineering and Engineering Geology
  • Metals and Alloys
  • Materials Chemistry

Cite this

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title = "Primary-transient creep and anelastic backflow of pure copper deformed at low temperatures and ultra-low strain rates",
abstract = "Creep and anelastic backflow behaviors of pure copper (4N Cu) with grain size dg=40 μm were investigated at low temperatures of T<0.3Tm (Tm is melting point) and ultra-low creep rates of ɛ˙=1×10−10s−1 by a high strain-resolution measurement (the helicoid spring specimen technique). Analysis of creep data was based on the scaling factors of creep curves instead of the conventional extrapolated steady-state creep rate. Power-law creep equation is suggested to be the best for describing the primary transient creep behavior, because the pre-parameter does not apparently change with elapsed time. The observed anelastic strains are 1/6 of the calculated elastic strains, and linear viscous behavior was identified from the logarithm plot of the anelastic strain rate versus anelastic strain (slope equals 1). Therefore, the creep anelasticity is suggested to be due to the unbowing of there-dimensional network of dislocations.",
author = "SHEN, {Jun jie} and IKEDA, {Ken ichi} and Satoshi Hata and Hideharu Nakashima",
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T1 - Primary-transient creep and anelastic backflow of pure copper deformed at low temperatures and ultra-low strain rates

AU - SHEN, Jun jie

AU - IKEDA, Ken ichi

AU - Hata, Satoshi

AU - Nakashima, Hideharu

PY - 2016/7/1

Y1 - 2016/7/1

N2 - Creep and anelastic backflow behaviors of pure copper (4N Cu) with grain size dg=40 μm were investigated at low temperatures of T<0.3Tm (Tm is melting point) and ultra-low creep rates of ɛ˙=1×10−10s−1 by a high strain-resolution measurement (the helicoid spring specimen technique). Analysis of creep data was based on the scaling factors of creep curves instead of the conventional extrapolated steady-state creep rate. Power-law creep equation is suggested to be the best for describing the primary transient creep behavior, because the pre-parameter does not apparently change with elapsed time. The observed anelastic strains are 1/6 of the calculated elastic strains, and linear viscous behavior was identified from the logarithm plot of the anelastic strain rate versus anelastic strain (slope equals 1). Therefore, the creep anelasticity is suggested to be due to the unbowing of there-dimensional network of dislocations.

AB - Creep and anelastic backflow behaviors of pure copper (4N Cu) with grain size dg=40 μm were investigated at low temperatures of T<0.3Tm (Tm is melting point) and ultra-low creep rates of ɛ˙=1×10−10s−1 by a high strain-resolution measurement (the helicoid spring specimen technique). Analysis of creep data was based on the scaling factors of creep curves instead of the conventional extrapolated steady-state creep rate. Power-law creep equation is suggested to be the best for describing the primary transient creep behavior, because the pre-parameter does not apparently change with elapsed time. The observed anelastic strains are 1/6 of the calculated elastic strains, and linear viscous behavior was identified from the logarithm plot of the anelastic strain rate versus anelastic strain (slope equals 1). Therefore, the creep anelasticity is suggested to be due to the unbowing of there-dimensional network of dislocations.

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