Probing the interfacial adhesion strength in compositional libraries of epoxy films

Christopher M. Stafford, Jae Hyun Kim, Daisuke Kawaguchi, Gareth Royston, Martin Y.M. Chiang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

We are developing a measurement platform, based on the edge delamination test geometry, geared towards combinatorial and high-throughput (C&HT) assessment of interfacial adhesion and reliability of epoxy films bonded to a rigid substrate. A critical parameter space to be explored is composition of the epoxy formulation. We have constructed an automated mixing and deposition system for creating discrete and continuous gradients in composition of viscous epoxy formulations. By dicing the combinatorial library into a contiguous discrete sample array, the interfacial adhesion strength can be deduced from the critical stress required to debond each film cell from the substrate. These results can be used to predict the adhesion reliability of epoxy formulations as a function of composition and applied stress.

Original languageEnglish
Title of host publicationMaterials Research Society Symposium Proceedings
Pages129-137
Number of pages9
Publication statusPublished - Jun 30 2006
Externally publishedYes
EventCombinatorial Methods and Informatics in Materials Science - Boston, MA, United States
Duration: Nov 28 2005Dec 1 2005

Publication series

NameMaterials Research Society Symposium Proceedings
Volume894
ISSN (Print)0272-9172

Other

OtherCombinatorial Methods and Informatics in Materials Science
CountryUnited States
CityBoston, MA
Period11/28/0512/1/05

Fingerprint

Bond strength (materials)
adhesion
formulations
Adhesion
Chemical analysis
critical loading
Substrates
Delamination
platforms
Throughput
gradients
Geometry
geometry
cells

All Science Journal Classification (ASJC) codes

  • Materials Science(all)
  • Condensed Matter Physics
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Stafford, C. M., Kim, J. H., Kawaguchi, D., Royston, G., & Chiang, M. Y. M. (2006). Probing the interfacial adhesion strength in compositional libraries of epoxy films. In Materials Research Society Symposium Proceedings (pp. 129-137). (Materials Research Society Symposium Proceedings; Vol. 894).

Probing the interfacial adhesion strength in compositional libraries of epoxy films. / Stafford, Christopher M.; Kim, Jae Hyun; Kawaguchi, Daisuke; Royston, Gareth; Chiang, Martin Y.M.

Materials Research Society Symposium Proceedings. 2006. p. 129-137 (Materials Research Society Symposium Proceedings; Vol. 894).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Stafford, CM, Kim, JH, Kawaguchi, D, Royston, G & Chiang, MYM 2006, Probing the interfacial adhesion strength in compositional libraries of epoxy films. in Materials Research Society Symposium Proceedings. Materials Research Society Symposium Proceedings, vol. 894, pp. 129-137, Combinatorial Methods and Informatics in Materials Science, Boston, MA, United States, 11/28/05.
Stafford CM, Kim JH, Kawaguchi D, Royston G, Chiang MYM. Probing the interfacial adhesion strength in compositional libraries of epoxy films. In Materials Research Society Symposium Proceedings. 2006. p. 129-137. (Materials Research Society Symposium Proceedings).
Stafford, Christopher M. ; Kim, Jae Hyun ; Kawaguchi, Daisuke ; Royston, Gareth ; Chiang, Martin Y.M. / Probing the interfacial adhesion strength in compositional libraries of epoxy films. Materials Research Society Symposium Proceedings. 2006. pp. 129-137 (Materials Research Society Symposium Proceedings).
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