Progress and perspective of optical MEMS packaging technology

Renshi Sawada, Hirofumi Nogami, Eiji Higurashi

    Research output: Contribution to journalArticlepeer-review

    Original languageEnglish
    Pages (from-to)558-566
    Number of pages9
    JournalJournal of Japan Institute of Electronics Packaging
    Volume21
    Issue number6
    DOIs
    Publication statusPublished - Sep 2018

    All Science Journal Classification (ASJC) codes

    • Electrical and Electronic Engineering

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