Properties of various plasma surface treatments for low-temperature Au-Au bonding

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

Research output: Contribution to journalArticle

8 Citations (Scopus)

Abstract

Atmospheric-pressure (AP) plasma treatment using three different types of gases (an argon-hydrogen mixed gas, an argon-oxygen mixed gas, and a nitrogen gas) and low-pressure (LP) plasma treatment using an argon gas were compared for Au-Au bonding with thin films and stud bumps at low temperature (25 or 150 °C) in ambient air. The argon-hydrogen gas mixture AP plasma treatment and argon LP plasma treatment were found to distinctly increase the shear bond strength for both samples at both temperatures. From X-ray photoelectron spectroscopy (XPS) analysis, the removal of organic contaminants on Au surfaces without the formation of hydroxyl groups and gold oxide is considered effective in increasing the Au-Au bonding strength at low temperature.

Original languageEnglish
Article number04FC12
JournalJapanese Journal of Applied Physics
Volume57
Issue number4
DOIs
Publication statusPublished - Apr 2018

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Fingerprint Dive into the research topics of 'Properties of various plasma surface treatments for low-temperature Au-Au bonding'. Together they form a unique fingerprint.

  • Cite this