Properties of various plasma surface treatments for low-temperature Au-Au bonding

Michitaka Yamamoto, Eiji Higurashi, Tadatomo Suga, Renshi Sawada, Toshihiro Itoh

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    11 Citations (Scopus)

    Abstract

    Atmospheric-pressure (AP) plasma treatment using three different types of gases (an argon-hydrogen mixed gas, an argon-oxygen mixed gas, and a nitrogen gas) and low-pressure (LP) plasma treatment using an argon gas were compared for Au-Au bonding with thin films and stud bumps at low temperature (25 or 150 °C) in ambient air. The argon-hydrogen gas mixture AP plasma treatment and argon LP plasma treatment were found to distinctly increase the shear bond strength for both samples at both temperatures. From X-ray photoelectron spectroscopy (XPS) analysis, the removal of organic contaminants on Au surfaces without the formation of hydroxyl groups and gold oxide is considered effective in increasing the Au-Au bonding strength at low temperature.

    Original languageEnglish
    Article number04FC12
    JournalJapanese journal of applied physics
    Volume57
    Issue number4
    DOIs
    Publication statusPublished - Apr 2018

    All Science Journal Classification (ASJC) codes

    • Engineering(all)
    • Physics and Astronomy(all)

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