Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet

Masashi Kitamura, Syuhei Kurokawa, Yuta Tokumoto, Terutake Hayashi, Hirokuni Hiyama, Yutaka Wada, Chikako Takatoh

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Citation (Scopus)

Abstract

This study is associated with pad conditioning using a high-pressure jet. The high-pressure jet is expected as a non- destructive conditioning method to achieve excellent pad cleaning and the long pad life. However, it is necessary to indicate the extent of the effect quantitatively in order to demonstrate the effect of conditioning. In this study, the authors proposed a method to evaluate pad cleanliness quantitatively by counting pores and debris on the pad surface. Cleanliness is one of the parameters representing the surface properties of the pad. Furthermore, the authors investigated the effect of cleaning by the high-pressure jet in accordance with the proposed method. As a result, it was possible to distinguish the difference of the cleaning effect quantitatively according to the difference of cleaning condition parameters. The results of this study can be applied to the evaluation of pad conditioning effect, and are useful for such as optimization of pad conditioning.

Original languageEnglish
Title of host publication2015 International Conference on Planarization/CMP Technology, ICPT 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781619565104
Publication statusPublished - Feb 17 2016
EventInternational Conference on Planarization/CMP Technology, ICPT 2015 - Chandler, United States
Duration: Sep 30 2015Oct 2 2015

Other

OtherInternational Conference on Planarization/CMP Technology, ICPT 2015
CountryUnited States
CityChandler
Period9/30/1510/2/15

Fingerprint

Cytidine Monophosphate
Cleaning
Debris
Surface properties

All Science Journal Classification (ASJC) codes

  • Process Chemistry and Technology
  • Electronic, Optical and Magnetic Materials

Cite this

Kitamura, M., Kurokawa, S., Tokumoto, Y., Hayashi, T., Hiyama, H., Wada, Y., & Takatoh, C. (2016). Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015 [7411952] Institute of Electrical and Electronics Engineers Inc..

Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. / Kitamura, Masashi; Kurokawa, Syuhei; Tokumoto, Yuta; Hayashi, Terutake; Hiyama, Hirokuni; Wada, Yutaka; Takatoh, Chikako.

2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc., 2016. 7411952.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kitamura, M, Kurokawa, S, Tokumoto, Y, Hayashi, T, Hiyama, H, Wada, Y & Takatoh, C 2016, Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. in 2015 International Conference on Planarization/CMP Technology, ICPT 2015., 7411952, Institute of Electrical and Electronics Engineers Inc., International Conference on Planarization/CMP Technology, ICPT 2015, Chandler, United States, 9/30/15.
Kitamura M, Kurokawa S, Tokumoto Y, Hayashi T, Hiyama H, Wada Y et al. Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. In 2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc. 2016. 7411952
Kitamura, Masashi ; Kurokawa, Syuhei ; Tokumoto, Yuta ; Hayashi, Terutake ; Hiyama, Hirokuni ; Wada, Yutaka ; Takatoh, Chikako. / Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet. 2015 International Conference on Planarization/CMP Technology, ICPT 2015. Institute of Electrical and Electronics Engineers Inc., 2016.
@inproceedings{752c957421554720a5eccf1199e8705e,
title = "Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet",
abstract = "This study is associated with pad conditioning using a high-pressure jet. The high-pressure jet is expected as a non- destructive conditioning method to achieve excellent pad cleaning and the long pad life. However, it is necessary to indicate the extent of the effect quantitatively in order to demonstrate the effect of conditioning. In this study, the authors proposed a method to evaluate pad cleanliness quantitatively by counting pores and debris on the pad surface. Cleanliness is one of the parameters representing the surface properties of the pad. Furthermore, the authors investigated the effect of cleaning by the high-pressure jet in accordance with the proposed method. As a result, it was possible to distinguish the difference of the cleaning effect quantitatively according to the difference of cleaning condition parameters. The results of this study can be applied to the evaluation of pad conditioning effect, and are useful for such as optimization of pad conditioning.",
author = "Masashi Kitamura and Syuhei Kurokawa and Yuta Tokumoto and Terutake Hayashi and Hirokuni Hiyama and Yutaka Wada and Chikako Takatoh",
year = "2016",
month = "2",
day = "17",
language = "English",
booktitle = "2015 International Conference on Planarization/CMP Technology, ICPT 2015",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
address = "United States",

}

TY - GEN

T1 - Proposal of cleanliness evaluation method of CMP pad, and investigation of cleaning effect by the high-pressure jet

AU - Kitamura, Masashi

AU - Kurokawa, Syuhei

AU - Tokumoto, Yuta

AU - Hayashi, Terutake

AU - Hiyama, Hirokuni

AU - Wada, Yutaka

AU - Takatoh, Chikako

PY - 2016/2/17

Y1 - 2016/2/17

N2 - This study is associated with pad conditioning using a high-pressure jet. The high-pressure jet is expected as a non- destructive conditioning method to achieve excellent pad cleaning and the long pad life. However, it is necessary to indicate the extent of the effect quantitatively in order to demonstrate the effect of conditioning. In this study, the authors proposed a method to evaluate pad cleanliness quantitatively by counting pores and debris on the pad surface. Cleanliness is one of the parameters representing the surface properties of the pad. Furthermore, the authors investigated the effect of cleaning by the high-pressure jet in accordance with the proposed method. As a result, it was possible to distinguish the difference of the cleaning effect quantitatively according to the difference of cleaning condition parameters. The results of this study can be applied to the evaluation of pad conditioning effect, and are useful for such as optimization of pad conditioning.

AB - This study is associated with pad conditioning using a high-pressure jet. The high-pressure jet is expected as a non- destructive conditioning method to achieve excellent pad cleaning and the long pad life. However, it is necessary to indicate the extent of the effect quantitatively in order to demonstrate the effect of conditioning. In this study, the authors proposed a method to evaluate pad cleanliness quantitatively by counting pores and debris on the pad surface. Cleanliness is one of the parameters representing the surface properties of the pad. Furthermore, the authors investigated the effect of cleaning by the high-pressure jet in accordance with the proposed method. As a result, it was possible to distinguish the difference of the cleaning effect quantitatively according to the difference of cleaning condition parameters. The results of this study can be applied to the evaluation of pad conditioning effect, and are useful for such as optimization of pad conditioning.

UR - http://www.scopus.com/inward/record.url?scp=84964499478&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84964499478&partnerID=8YFLogxK

M3 - Conference contribution

BT - 2015 International Conference on Planarization/CMP Technology, ICPT 2015

PB - Institute of Electrical and Electronics Engineers Inc.

ER -