Quantitative evaluation of slurry flow behavior using digital image processing

Michio Uneda, Shintaro Murata, Takashi Narise, Tsutomu Yamazaki, Osamu Ohnishi, Syuhei Kurokawa, Ken Ichi Ishikawa, Toshiro Doi

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Lapping is generally used in fabricating high-accuracy hard and brittle materials. In lapping, slurry mixed free abrasive grains and water or dispersion oil is used. It is well known that the lapping characteristics are affected by actual slurry flow in the contact surface between the workpiece and lapping platen. Therefore, stabilization of slurry flow is required to improve lapping characteristics. This paper presents both quantitative evaluation method and results of slurry flow behavior at lapping process, and investigates the movement direction and velocity of slurry flow behavior. Single wafer lapping method was used for our experiment. Furthermore, digital image correlation (DIC) method was used for quantification. As a result, the following points were observed. (1) DIC method can evaluate slurry flow behavior among full-field observed photographed area. (2) Slurry flow velocity has not correlation with relative lapping velocity between the workpiece and lapping platen. (3) Slurry flows much into contact surface along a turn of lapping platen.

Original languageEnglish
Pages (from-to)3891-3903
Number of pages13
JournalNihon Kikai Gakkai Ronbunshu, C Hen/Transactions of the Japan Society of Mechanical Engineers, Part C
Issue number782
Publication statusPublished - 2011

All Science Journal Classification (ASJC) codes

  • Mechanics of Materials
  • Mechanical Engineering
  • Industrial and Manufacturing Engineering


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