Real time synchrotron x-ray imaging for nucleation and growth of cu6sn5 in sn-7cu-0.05ni high temperature lead-free solder alloys

Kazuhiro Nogita, Hideyuki Yasuda, Stuart D. Mcdonald, And Kentaro Uesugi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Citations (Scopus)

Abstract

This paper demonstrates how recent progress for real-time solidification observation at SPring-8 synchrotron has contributed to the development of Sn-7wt%Cu-0.05wt%Ni high temperature lead-free solder alloys. Lead-free solder alloys in the composition range Sn-0.7 to 7.6wt%Cu that consist of primary Cu6Sn5 in a eutectic Sn-Cu6Sn5 matrix have been proposed as solders for application at temperatures up to 400°C for the assembly high current semiconductors. It is shown that trace levels of Al have a marked effect on the solder microstructure and refine the size of the primary Cu6Sn5. The solidification pathway that leads to the refinement was observed in real-time using X-ray synchrotron observations.

Original languageEnglish
Title of host publicationAdvanced Materials Engineering and Technology
Pages200-204
Number of pages5
DOIs
Publication statusPublished - 2013
Event2012 International Conference on Advanced Materials Engineering and Technology, ICAMET 2012 - Penang, Malaysia
Duration: Nov 28 2012Nov 30 2012

Publication series

NameAdvanced Materials Research
Volume626
ISSN (Print)1022-6680

Other

Other2012 International Conference on Advanced Materials Engineering and Technology, ICAMET 2012
Country/TerritoryMalaysia
CityPenang
Period11/28/1211/30/12

All Science Journal Classification (ASJC) codes

  • Engineering(all)

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