Release behavior of tritium in pure copper and its alloys into pure water at ambient temperature

Teppei Otsuka, Yusuke Ogawa, Hiroki Horinouchi, Kenichi Hashizume

    Research output: Contribution to journalArticle

    Abstract

    Release behaviors of tritium (T) from pure copper (Cu) and its alloys into pure water were examined at ambient temperature by a tritium imaging plate technique and a liquid scintillation counting technique. Two mechanisms govern the liberation of T into pure water; one is rapid release and the other is chronic release. The former is caused by diffusional release of T dissolved in bulk of Cu alloys and the latter by release of T strongly bound on/in surface oxide layers.

    Original languageEnglish
    Pages (from-to)227-230
    Number of pages4
    JournalFusion Engineering and Design
    Volume113
    DOIs
    Publication statusPublished - Dec 1 2016

    Fingerprint

    Tritium
    Copper alloys
    Copper
    Water
    Scintillation
    Oxides
    Imaging techniques
    Temperature
    Liquids

    All Science Journal Classification (ASJC) codes

    • Civil and Structural Engineering
    • Nuclear Energy and Engineering
    • Materials Science(all)
    • Mechanical Engineering

    Cite this

    Release behavior of tritium in pure copper and its alloys into pure water at ambient temperature. / Otsuka, Teppei; Ogawa, Yusuke; Horinouchi, Hiroki; Hashizume, Kenichi.

    In: Fusion Engineering and Design, Vol. 113, 01.12.2016, p. 227-230.

    Research output: Contribution to journalArticle

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