Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology

Mokhtar Aly, Gamal M. Dousoky, Masahito Shoyama

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This paper introduces design and validation of space vector pulse width modulation (SVPWM) algorithm for reliability enhancement of multilevel inverters. Thermal overheating is the main cause of shortened-lifetime and open-circuit faults of power devices. It may result from ageing of semiconductor materials due to continuous operation and various operating conditions. Degradation and faults of cooling system are also of the major causes of overheating in power components. The proposed algorithm is applied when an overheating is detected in any of the semiconductor devices and helps to alleviate the overheating from the affected device and thereby preventing the overall system from malfunction. The proposed methodology relies on using the redundancy property between the switching states in multilevel inverters to continuously evaluate a cost function of the junction temperature of the overheated devices for all possible switching sequences, then it selects the optimal relieving switching sequence. Therefore, the lifetime of the overheated device can be considerably elongated. The proposed algorithm has been designed, simulated, and experimentally validated using a T-type three-level inverter system.

Original languageEnglish
Title of host publication2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9781479976577
DOIs
Publication statusPublished - Dec 18 2015
Event2nd IEEE International Future Energy Electronics Conference, IFEEC 2015 - Taipei, Taiwan, Province of China
Duration: Nov 1 2015Nov 4 2015

Other

Other2nd IEEE International Future Energy Electronics Conference, IFEEC 2015
CountryTaiwan, Province of China
CityTaipei
Period11/1/1511/4/15

Fingerprint

Vector spaces
Temperature control
Pulse width modulation
Semiconductor devices
Cooling systems
Cost functions
Redundancy
Aging of materials
Semiconductor materials
Degradation
Networks (circuits)
Temperature

All Science Journal Classification (ASJC) codes

  • Energy Engineering and Power Technology
  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering

Cite this

Aly, M., Dousoky, G. M., & Shoyama, M. (2015). Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology. In 2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015 [7361605] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/IFEEC.2015.7361605

Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology. / Aly, Mokhtar; Dousoky, Gamal M.; Shoyama, Masahito.

2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015. Institute of Electrical and Electronics Engineers Inc., 2015. 7361605.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Aly, M, Dousoky, GM & Shoyama, M 2015, Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology. in 2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015., 7361605, Institute of Electrical and Electronics Engineers Inc., 2nd IEEE International Future Energy Electronics Conference, IFEEC 2015, Taipei, Taiwan, Province of China, 11/1/15. https://doi.org/10.1109/IFEEC.2015.7361605
Aly M, Dousoky GM, Shoyama M. Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology. In 2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015. Institute of Electrical and Electronics Engineers Inc. 2015. 7361605 https://doi.org/10.1109/IFEEC.2015.7361605
Aly, Mokhtar ; Dousoky, Gamal M. ; Shoyama, Masahito. / Reliability enhancement of multilevel inverters through SVPWM-based thermal management methodology. 2015 IEEE 2nd International Future Energy Electronics Conference, IFEEC 2015. Institute of Electrical and Electronics Engineers Inc., 2015.
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