Review of Microfluidic Devices for On-Chip Chemical Sensing

Takahiro Watanabe, Fumihiro Sassa, Yoshitaka Yoshizumi, Hiroaki Suzuki

Research output: Contribution to journalArticle

3 Citations (Scopus)

Abstract

Microfluidic techniques can be a basis to realize user-friendly microanalytical devices of high performance. Required operations include injection of solutions to reaction chambers, volume measurement, and mixing of solutions. For this purpose, the use of surface tension is attractive. In hydrophobic flow channels, solutions can be moved stably in the form of plugs. Otherwise, solutions can be transported by capillary action in a hydrophilic flow channel and stopped at a hydrophobic valve. The valve can be opened autonomously by switching the mixed potential by wetting a zinc electrode formed in a controlling flow channel. In this review paper, we introduce some of our microfluidic devices particularly focusing on devices that work based on surface tension.

Original languageEnglish
Pages (from-to)25-32
Number of pages8
JournalElectronics and Communications in Japan
Volume100
Issue number4
DOIs
Publication statusPublished - Apr 1 2017

Fingerprint

Channel Flow
microfluidic devices
Microfluidics
Chip
Sensing
channel flow
Channel flow
chips
Surface Tension
Surface tension
interfacial tension
Wetting
Zinc
Volume measurement
Electrode
Injection
plugs
High Performance
wetting
zinc

All Science Journal Classification (ASJC) codes

  • Signal Processing
  • Physics and Astronomy(all)
  • Computer Networks and Communications
  • Electrical and Electronic Engineering
  • Applied Mathematics

Cite this

Review of Microfluidic Devices for On-Chip Chemical Sensing. / Watanabe, Takahiro; Sassa, Fumihiro; Yoshizumi, Yoshitaka; Suzuki, Hiroaki.

In: Electronics and Communications in Japan, Vol. 100, No. 4, 01.04.2017, p. 25-32.

Research output: Contribution to journalArticle

Watanabe, Takahiro ; Sassa, Fumihiro ; Yoshizumi, Yoshitaka ; Suzuki, Hiroaki. / Review of Microfluidic Devices for On-Chip Chemical Sensing. In: Electronics and Communications in Japan. 2017 ; Vol. 100, No. 4. pp. 25-32.
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