Room-temperature bonding mechanism of compliant bump with ultrasonic assist

Keiichiro Iwanabe, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We discuss bonding mechanism of ultrasonic bonding of cone-shaped bump. Room-temperature microjoining of Au-Au or Cu-Cu bumps in the air ambient has been achieved by using the cone-shaped bumps with ultrasonic assist. We have investigated two characteristics of ultrasonic bonding. We first investigate effect of the application of ultrasonic vibration on magnitude of plastic deformation of the compliant bump. We show that 'softening' of the bump takes place under the application of ultrasonic vibration. Secondly, change in crystal texture near the bonded interface was analyzed to clarify how the ultrasonic bonding produce bonded interface at room-temperature. Under application of ultrasonic vibration, recrystallization of grains takes place near the interface to transform to fine crystallites. The thermocompression bonding, on the other hand, generates fine crystals in the bulk of the cone-shaped bump. This difference in location where recrystallization generates can be interpreted by taking shear strain distribution into consideration. The room temperature bonding can be interpreted by the generation of fine crystallites at the interface which results in breaking of a contaminant layer at the interface.

Original languageEnglish
Title of host publication2015 International 3D Systems Integration Conference, 3DIC 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
PagesTS8.15.1-TS8.15.4
ISBN (Electronic)9781467393850
DOIs
Publication statusPublished - Nov 20 2015
EventInternational 3D Systems Integration Conference, 3DIC 2015 - Sendai, Japan
Duration: Aug 31 2015Sep 2 2015

Publication series

Name2015 International 3D Systems Integration Conference, 3DIC 2015

Other

OtherInternational 3D Systems Integration Conference, 3DIC 2015
CountryJapan
CitySendai
Period8/31/159/2/15

All Science Journal Classification (ASJC) codes

  • Electrical and Electronic Engineering

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