Room-temperature bonding of heterogeneous materials for near-infrared image sensor

Takanori Shuto, Keiichiro Iwanabe, Mutsuo Ogura, Katsuhiko Nishida, Tanemasa Asano

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11 Citations (Scopus)


A room-temperature bonding technique using cone-shaped microbumps with the aid of ultrasonic vibration is applied to the fabrication of a nearinfrared (NIR) image sensor. The image sensor is fabricated using the chip-on-chip integration of an InGaAs photodiode array on an InP substrate and a Si CMOS readout IC. The pixel pitch is 25μm to compose quarter-VGA class (320×256 pixels) resolution. A high-quality imaging of a heated object is demonstrated. Bonding of the VGA array with 15μm pitch is attempted to realize a high-resolution image sensor.

Original languageEnglish
Article number04EB01
JournalJapanese Journal of Applied Physics
Issue number4 SPEC. ISSUE
Publication statusPublished - Apr 2014


All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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