Room-temperature bonding of vertical-cavity surface-emitting laser chips on Si substrates using Au microbumps in ambient air

Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Renshi Sawada

    Research output: Contribution to journalArticlepeer-review

    47 Citations (Scopus)

    Abstract

    The feasibility of room-temperature (RT) bonding of vertical-cavity surface-emitting laser (VCSEL) chips on silicon (Si) substrates with Au microbumps was demonstrated by Au-Au surface-activated bonding. The diameter at the top, the height, and the pitch of Au microbumps measured approximately 5, 2, and 10μm, respectively. Following activation of the Au surfaces with argon radio-frequency plasma, Au-Au bonding was carried out using contact at RT in ambient air. The measured results of light-current-voltage (L-I-V) characteristics indicated no significant degradation of the VCSEL chips after bonding.

    Original languageEnglish
    Pages (from-to)1122011-1122012
    Number of pages2
    JournalApplied Physics Express
    Volume1
    Issue number11
    DOIs
    Publication statusPublished - Nov 1 2008

    All Science Journal Classification (ASJC) codes

    • Engineering(all)
    • Physics and Astronomy(all)

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