TY - JOUR
T1 - Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection
AU - Watanabe, Naoya
AU - Asano, Tanemasa
PY - 2010/4
Y1 - 2010/4
N2 - We propose room-temperature three-dimensional (3D) chip-stacking using the mechanical caulking effect of compliant bumps. The compliant bumps were cone-shaped bump made of Au. By caulking Au cone bumps with doughnut-shaped electrodes also made of Au, high-density largenumber inter-chip connections were realized even at room temperature in ambient air. The number of inter-chip connections realized was 30,600 with 20 μm pitch. Material analysis revealed that Au cone bumps bonded to Au doughnut-shaped electrodes at the atomic level.
AB - We propose room-temperature three-dimensional (3D) chip-stacking using the mechanical caulking effect of compliant bumps. The compliant bumps were cone-shaped bump made of Au. By caulking Au cone bumps with doughnut-shaped electrodes also made of Au, high-density largenumber inter-chip connections were realized even at room temperature in ambient air. The number of inter-chip connections realized was 30,600 with 20 μm pitch. Material analysis revealed that Au cone bumps bonded to Au doughnut-shaped electrodes at the atomic level.
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U2 - 10.1143/JJAP.49.04DB02
DO - 10.1143/JJAP.49.04DB02
M3 - Article
AN - SCOPUS:77952692895
SN - 0021-4922
VL - 49
JO - Japanese Journal of Applied Physics
JF - Japanese Journal of Applied Physics
IS - 4 PART 2
M1 - 04DB02
ER -