Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection

Naoya Watanabe, Tanemasa Asano

Research output: Contribution to journalArticle

10 Citations (Scopus)

Abstract

We propose room-temperature three-dimensional (3D) chip-stacking using the mechanical caulking effect of compliant bumps. The compliant bumps were cone-shaped bump made of Au. By caulking Au cone bumps with doughnut-shaped electrodes also made of Au, high-density largenumber inter-chip connections were realized even at room temperature in ambient air. The number of inter-chip connections realized was 30,600 with 20 μm pitch. Material analysis revealed that Au cone bumps bonded to Au doughnut-shaped electrodes at the atomic level.

Original languageEnglish
Article number04DB02
JournalJapanese Journal of Applied Physics
Volume49
Issue number4 PART 2
DOIs
Publication statusPublished - Apr 1 2010

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caulking
Cones
cones
chips
room temperature
Electrodes
electrodes
Temperature
air
Air

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Room-temperature bonding using mechanical caulking effect of compliant bumps for chip-stack interconnection. / Watanabe, Naoya; Asano, Tanemasa.

In: Japanese Journal of Applied Physics, Vol. 49, No. 4 PART 2, 04DB02, 01.04.2010.

Research output: Contribution to journalArticle

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