Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates

J. J. Shen, K. Ikeda, Satoshi Hata, Hideharu Nakashima

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Citation (Scopus)

Abstract

The creep behavior in pure aluminum has been investigated by helicoid spring creep tests at strain rates, ε, lower than 10-10 s-1 and room temperature, 298 K. It was found that the creep behavior at the very low ε depends strongly on grain sizes and impurity concentrations: in highpurity aluminum (5 N Al) with an average grain size of 24 μm, the stress exponent was n ~ 1; while, when the average grain size was larger than 1600 μm, the stress exponent was n ~ 5. Microstructural observation shows the formation of large dislocation cells, 10 μm. On the other hand, in commercial low-purity aluminum (2 N Al) with the average grain size of 25 μm, the stress exponent was n = 2. Microstructural observations revealed dislocations emitted from grain boundaries and the formation of lattice dislocation cells. To evaluate creep deformation mechanisms of the pure aluminum, stress change tests were conducted during creep tests. It was revealed that the deformation in the range of the stress exponent, n ~ 5, was controlled by recovery driven by internal stress, σi, because instantaneous strains at stress increment were larger than that at stress reduction. While the deformation behaviors in the ranges of the stress exponents, n ~ 1 and n = 2, were in viscous manner, because instantaneous strains at stress increment and reduction were in the same level. Based on those experimental results, the creep mechanisms have been discussed.

Original languageEnglish
Title of host publicationSupplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling
PublisherJohn Wiley and Sons Inc.
Pages585-592
Number of pages8
Volume2
ISBN (Electronic)9781118062142
ISBN (Print)9781118029466
DOIs
Publication statusPublished - Apr 20 2011

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Aluminum
Strain rate
Creep
Temperature
Dislocations (crystals)
Crystal lattices
Residual stresses
Grain boundaries
Impurities
Recovery

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Materials Science(all)

Cite this

Shen, J. J., Ikeda, K., Hata, S., & Nakashima, H. (2011). Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates. In Supplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling (Vol. 2, pp. 585-592). John Wiley and Sons Inc.. https://doi.org/10.1002/9781118062142.ch70

Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates. / Shen, J. J.; Ikeda, K.; Hata, Satoshi; Nakashima, Hideharu.

Supplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling. Vol. 2 John Wiley and Sons Inc., 2011. p. 585-592.

Research output: Chapter in Book/Report/Conference proceedingChapter

Shen, JJ, Ikeda, K, Hata, S & Nakashima, H 2011, Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates. in Supplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling. vol. 2, John Wiley and Sons Inc., pp. 585-592. https://doi.org/10.1002/9781118062142.ch70
Shen JJ, Ikeda K, Hata S, Nakashima H. Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates. In Supplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling. Vol. 2. John Wiley and Sons Inc. 2011. p. 585-592 https://doi.org/10.1002/9781118062142.ch70
Shen, J. J. ; Ikeda, K. ; Hata, Satoshi ; Nakashima, Hideharu. / Room Temperature Creep and Substructure Formation in Pure Aluminum at Ultra-Low Strain Rates. Supplemental Proceedings: Materials Fabrication, Properties, Characterization, and Modeling. Vol. 2 John Wiley and Sons Inc., 2011. pp. 585-592
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