We demonstrate room-temperature Cu-Cu bonding in ambient air by using a Cu cone bump in combination with a Cu electrode with a cross- shaped slit. By wedging the Cu cone bump into the cross-shaped slit, a bonded interface that is substantially free from contaminants can be formed. The cross-shaped slit gives lower connection resistance than a simple hole. The resistance per connection was approximately 83mω.
All Science Journal Classification (ASJC) codes
- Physics and Astronomy(all)