TY - JOUR
T1 - Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim
AU - Takigawa, Ryo
AU - Iwanabe, Keiichiro
AU - Shuto, Takanori
AU - Takao, Takayuki
AU - Asano, Tanemasa
PY - 2014/1/1
Y1 - 2014/1/1
N2 - We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-temperature vacuum sealing using the compliant rim made of Au with the aid of ultrasonic vibration of submicron amplitude. A test vehicle fabricated using silicon and glass showed that the air leak rate of the room-temperature sealing was well below 1 × 10-12 Pa.m3/s, which is sufficiently low for use in vacuum packaging.
AB - We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-temperature vacuum sealing using the compliant rim made of Au with the aid of ultrasonic vibration of submicron amplitude. A test vehicle fabricated using silicon and glass showed that the air leak rate of the room-temperature sealing was well below 1 × 10-12 Pa.m3/s, which is sufficiently low for use in vacuum packaging.
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U2 - 10.7567/JJAP.53.06JM05
DO - 10.7567/JJAP.53.06JM05
M3 - Article
AN - SCOPUS:84903314956
VL - 53
JO - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
JF - Japanese Journal of Applied Physics, Part 1: Regular Papers & Short Notes
SN - 0021-4922
IS - 6 SPEC. ISSUE
M1 - 06JM05
ER -