Room-temperature hermetic sealing by ultrasonic bonding with Au compliant rim

Ryo Takigawa, Keiichiro Iwanabe, Takanori Shuto, Takayuki Takao, Tanemasa Asano

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14 Citations (Scopus)

Abstract

We newly introduce a compliant rim to realize hermetic sealing of electronic components at low temperature. The compliant rim easily deforms under pressing load owing to its cone-shaped cross section and, therefore, intermetallic bonding can be performed at low temperature. We demonstrate the room-temperature vacuum sealing using the compliant rim made of Au with the aid of ultrasonic vibration of submicron amplitude. A test vehicle fabricated using silicon and glass showed that the air leak rate of the room-temperature sealing was well below 1 × 10-12 Pa.m3/s, which is sufficiently low for use in vacuum packaging.

Original languageEnglish
Article number06JM05
JournalJapanese Journal of Applied Physics
Volume53
Issue number6 SPEC. ISSUE
DOIs
Publication statusPublished - Jan 1 2014

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All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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