Room temperature micro-joining of LSIs using cone shaped bump

Tanemasa Asano

Research output: Contribution to journal › Article

Original language	English
Pages (from-to)	725-729
Number of pages	5
Journal	Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume	79
Issue number	8
DOIs	https://doi.org/10.2493/jjspe.79.725
Publication status	Published - Jan 1 2013

All Science Journal Classification (ASJC) codes

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title = "Room temperature micro-joining of LSIs using cone shaped bump",

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