Room temperature micro-joining of LSIs using cone shaped bump

Tanemasa Asano

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)725-729
Number of pages5
JournalSeimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume79
Issue number8
DOIs
Publication statusPublished - Jan 1 2013

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Flexible electronics
Joining
Cones
Temperature

All Science Journal Classification (ASJC) codes

  • Mechanical Engineering

Cite this

Room temperature micro-joining of LSIs using cone shaped bump. / Asano, Tanemasa.

In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 79, No. 8, 01.01.2013, p. 725-729.

Research output: Contribution to journalArticle

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