Room temperature micro-joining of LSIs using cone shaped bump

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	725-729
Number of pages	5
Journal	Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
Volume	79
Issue number	8
DOIs	https://doi.org/10.2493/jjspe.79.725
Publication status	Published - Aug 2013

All Science Journal Classification (ASJC) codes

@article{90d0f39ce2e44479a8dbe4d35d7bef44,

title = "Room temperature micro-joining of LSIs using cone shaped bump",

author = "Tanemasa Asano",

year = "2013",

month = aug,

doi = "10.2493/jjspe.79.725",

language = "English",

volume = "79",

pages = "725--729",

journal = "Journal of the Japan Society for Precision Engineering",

issn = "0912-0289",

publisher = "Japan Society for Precision Engineering",

number = "8",

}

TY - JOUR

T1 - Room temperature micro-joining of LSIs using cone shaped bump

AU - Asano, Tanemasa

PY - 2013/8

Y1 - 2013/8

UR - http://www.scopus.com/inward/record.url?scp=84882799914&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84882799914&partnerID=8YFLogxK

U2 - 10.2493/jjspe.79.725

DO - 10.2493/jjspe.79.725

M3 - Article

AN - SCOPUS:84882799914

VL - 79

SP - 725

EP - 729

JO - Journal of the Japan Society for Precision Engineering

JF - Journal of the Japan Society for Precision Engineering

SN - 0912-0289

IS - 8

ER -