| Original language | English |
|---|---|
| Pages (from-to) | 725-729 |
| Number of pages | 5 |
| Journal | Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering |
| Volume | 79 |
| Issue number | 8 |
| DOIs | |
| Publication status | Published - Jan 1 2013 |
Fingerprint
Flexible electronics
Joining
Cones
Temperature
All Science Journal Classification (ASJC) codes
- Mechanical Engineering
Cite this
Room temperature micro-joining of LSIs using cone shaped bump. / Asano, Tanemasa.
In: Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, Vol. 79, No. 8, 01.01.2013, p. 725-729.Research output: Contribution to journal › Article
Asano, T 2013, 'Room temperature micro-joining of LSIs using cone shaped bump', Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering, vol. 79, no. 8, pp. 725-729. https://doi.org/10.2493/jjspe.79.725
@article{90d0f39ce2e44479a8dbe4d35d7bef44,
title = "Room temperature micro-joining of LSIs using cone shaped bump",
author = "Tanemasa Asano",
year = "2013",
month = "1",
day = "1",
doi = "10.2493/jjspe.79.725",
language = "English",
volume = "79",
pages = "725--729",
journal = "Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering",
issn = "0912-0289",
publisher = "Japan Society for Precision Engineering",
number = "8",
}
TY - JOUR
T1 - Room temperature micro-joining of LSIs using cone shaped bump
AU - Asano, Tanemasa
PY - 2013/1/1
Y1 - 2013/1/1
UR - http://www.scopus.com/inward/record.url?scp=84882799914&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84882799914&partnerID=8YFLogxK
U2 - 10.2493/jjspe.79.725
DO - 10.2493/jjspe.79.725
M3 - Article
VL - 79
SP - 725
EP - 729
JO - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
JF - Seimitsu Kogaku Kaishi/Journal of the Japan Society for Precision Engineering
SN - 0912-0289
IS - 8
ER -