Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184mΩ/bump has been achieved at room temperature.

Original languageEnglish
Article number04DB04
JournalJapanese Journal of Applied Physics
Volume51
Issue number4 PART 2
DOIs
Publication statusPublished - Apr 1 2012

Fingerprint

caulking
large scale integration
Cones
cones
Ethylene
ethylene
chips
Electrodes
electrodes
Electroless plating
electroplating
Electroplating
Photolithography
room temperature
photolithography
plating
resins
slits
counters
Resins

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

Cite this

Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump. / Shuto, Takanori; Watanabe, Naoya; Ikeda, Akihiro; Asano, Tanemasa.

In: Japanese Journal of Applied Physics, Vol. 51, No. 4 PART 2, 04DB04, 01.04.2012.

Research output: Contribution to journalArticle

Shuto, Takanori ; Watanabe, Naoya ; Ikeda, Akihiro ; Asano, Tanemasa. / Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump. In: Japanese Journal of Applied Physics. 2012 ; Vol. 51, No. 4 PART 2.
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