Room-temperature microjoining of LSI chips on poly(ethylene naphthalate) film using mechanical caulking of Au cone bump

Takanori Shuto, Naoya Watanabe, Akihiro Ikeda, Tanemasa Asano

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

We show that room-temperature bonding of LSI chips on a resin film made of poly(ethylene naphthalate) (PEN) can be realized by using mechanical caulking of a cone-shaped bump electrode made of Au. A 20-μm-pitch area array of cone-shaped Au bumps was fabricated on a Si wafer by photolithography and electroplating. The counter electrode with cross-shaped slits on the PEN film was composed of a Au (top)/Ni/Al (bottom) layered structure, where Ni and Au layers were deposited by electroless plating on patterned Al. Bonding of about 10,000 bump connections with 184mΩ/bump has been achieved at room temperature.

Original languageEnglish
Article number04DB04
JournalJapanese journal of applied physics
Volume51
Issue number4 PART 2
DOIs
Publication statusPublished - Apr 1 2012

All Science Journal Classification (ASJC) codes

  • Engineering(all)
  • Physics and Astronomy(all)

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