Room temperature microjoining of qVGA class area-bump array using cone bump

Takanori Shuto, Keiichiro Iwanabe, Li Jing Qiu, Tanemasa Asano

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We show that room temperature microjoining a 332 x 268 array of bumps can be realized by using ultrasonic bonding of cone-shaped microbump. 20 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A flat planar electrode made of electoplated Au was used as the counter electrode. Ultrasonic bonding was carried out at room temperature in ambient air. Electrical connection test shows all bump connections with low resistance have been achieved.

Original languageEnglish
Title of host publication2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
DOIs
Publication statusPublished - Dec 1 2012
Event2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 - Kyoto, Japan
Duration: Dec 10 2012Dec 12 2012

Publication series

Name2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012

Other

Other2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012
CountryJapan
CityKyoto
Period12/10/1212/12/12

All Science Journal Classification (ASJC) codes

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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    Shuto, T., Iwanabe, K., Qiu, L. J., & Asano, T. (2012). Room temperature microjoining of qVGA class area-bump array using cone bump. In 2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012 [6523389] (2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012). https://doi.org/10.1109/ICSJ.2012.6523389